solder|solar|thermal|flux|semiconductor|indium|material|Indium Corporation
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New Technical Papers
AuSn Die-Attach Solder
Amanda Hartnett provided a tech paper she presented at iMAPS 2009: 42nd International Symposium on Microelectronics (November 1-5, San José, CA) on the advantages of gold-tin die-attach solder. RF mounting and MEMS packages both benefit from the solder alloy's properties.
Learn more, contact AmandaAddressing the Challenge of Head-in-Pillow Defects in Electronics Assembly, by Mario Scalzo talks about the sources of head-in-pillow defects and how they can be eliminated.
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly, by Chris Anglin summarizes a significant amount of experimental data and process optimization techniques that were employed to establish a precision SMT printing process.
Challenges for Implementing a Halogen-Free Process, by Tim Jensen and Ron Lasky discusses the reasons why the industry is moving toward halogen-free, what materials might contain halogens, and the process development issues in establishing a halogen-free assembly process.
Bismuth Can Solve Your Challenges
- Melting point (MP): 271°C
- Alloys with several other elements.
- Common alloys:
- 66.6In 33.3Bi melts at 72°C
- 57Bi 26In 17Sn melts at 79°C
- 50Bi 28Pb 22Sn melts at 100°C
- 58Bi 42Sn melts at 138°C
- 57Bi 42Sn 1Ag) melts at 140°C
- Common Applications:
- Fusible Alloys
- Low-melting point solders
- Lens blocking and polishing
- Alloys used as sinkers and shot
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Indium8.9 can help you:
Increase finished goods reliability.
Increase finished goods first-pass yield.
Increase manufacturing process efficiencies.
Reduce average process cycle time by reducing downtime.
Reduce total cost of usage.
Reduce process scrap.
Enhance finished goods performance.
Increase operational profitability.
Learn More ► Solder Preforms
Solders Engineered to your exact specifications.
• Solder preforms
• Solder wire
• Solder ribbon
• Solder fluxes
• More
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SEMICONDUCTOR ASSEMBLY MATERIALS SCIENCE

Check out our hot new brochure.
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TIM: Thermal
Interface Materials
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SOLAR
Materials Science
OBSESSED With Solder Paste
Are you as obsessed with soldering as we are?
Eliminate Pb-Free Wave Soldering
Learn how the PIP+ Process can improve your quality and save you money.Pb-Free.com
A free source of solder information, links, and tools
Just added: Take the “Pb-Free Solder Readiness Assessment.”
The Global Impact of the Increasing Cost of Metals
Read how the supply and demand of tin and silver has affected the Assembly Electronics Industry.
Product Showcase
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Solder Preforms on Tape & Reel
Learn how solder preforms can help you ELIMINATE Pb-Free Wave Soldering -
Pb-Free Solder Fabrications
Indium Metal
The Indium Corporation is the world’s premiere supplier of indium metal. We produce all grades of purity, sizes, shapes, and quantities.Wave Solder Assembly Materials
Wave soldering is still preferred for many kinds of assembly operations, and often complements reflow assembly. Wave soldering is particularly suited to continuous production.
About Indium Corporation
Indium Corporation of America is an ISO 9001-registered developer, manufacturer, and supplier of specialty alloys and solders (including solder paste, solder preforms, solder spheres, solder wire, solder tubing, solder ribbon, and solder foil), solder fluxes, electrically-conductive adhesives, inorganic indium compounds (including indium oxide, indium-tin oxide, indium hydroxide, and indium chloride), fusible alloys, indium-containing fabrications of all types, and pure indium (from commercial grade through high-purity grade). The company is a five-time recipient of the Frost & Sullivan Award.
Founded in 1934, Indium Corporation of America is based in Utica, New York, USA. It operates manufacturing facilities in China, England, Singapore, and the USA. The company has Sales offices at several locations throughout the world.
Indium Corporation does not recommend, manufacture, market, or endorse any of our products for human consumption.











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