circuit board

Adam Murling

Adam Murling

Technical Support Engineer, Global Accounts

Indium Corporation
Phone: +1 (315) 853-4900 x2224
E-mail: amurling@indium.com

  • Certifications:
  • 6 Sigma Green Belt
  • SMTA

Blog

Adam Murling's Blog

Biography

Adam is a technical support engineer based at Indium Corporation’s global headquarters in Clinton, N.Y., USA. He is responsible for providing leading-edge technical support for Indium’s global account initiatives through SMT process optimization, material recommendations, and customer training. He nurtures existing accounts and assists in strategy development for obtaining new accounts. Adam also plans and executes customer and internal designs-of-experiments. He is an SMTA-Certified Process Engineer, an active blogger, and he has authored technical papers on wave solder fluxes and solder preforms.

Murling has a bachelor’s degree in chemical engineering from Clarkson University. While at Clarkson he worked as a researcher for the Partch Research Group where he converted biomass into fuel oil using a Parr high-pressure reactor. Murling also interned at the Air Force Research Laboratory in Rome, where he performed nanotechnology research.

Adam lives in Rome, N.Y. In his spare time he plays the saxophone, cooks, and plays bridge.

Adam Murling's Blog Posts

Reinforced Solder Preforms for High-Reliability and Low Voiding | Voiding Results

24 Feb 2017 by Adam Murling [view bio]

This is the last in a series of blog posts that discusses reinforced Solder Preforms for high–reliability and low voiding. Today's focus is voiding.

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Reinforced Solder Preforms for High-Reliability and Low Voiding | Voiding DOE

22 Feb 2017 by Adam Murling [view bio]

This is the fourth in a series of posts that talks about reinforced Solder Preforms for high–reliability and low voiding. Today's focus is voiding reduction.

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Reinforced Solder Preforms for High-Reliability and Low Voiding | Quantifiable Bondline Consistency

20 Feb 2017 by Adam Murling [view bio]

This is the third in a series of blog posts that talks about reinforced Solder Preforms for high–reliability and low voiding. Quantifiable bondline consistency is today's topic.

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