Technical Support Engineer, Southwest / Rocky Mountains U.S.
Phone: +1 315 853 4900 x2213
Address: 34 Robinson Rd., Clinton, NY USA 13323
- Green Belt
Brandon is a Technical Support Engineer supporting Indium's advanced SMT materials, including solder pastes, thermal interface materials, and engineered solders. He specializes in the optimization of SMT lines, such as stencil printing parameters and reflow profiling. In addition to offering customer support, he spends a great deal of time performing testing on new products at Indium’s internal simulation lab.
Brandon has a bachelor’s degree in Mechanical Engineering Technology from the State University of New York Institute of Technology. He is an SMTA-certified process engineer (CSMTPE) and has earned his Lean Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is also a certified IPC-A-600 and 610D Specialist.
Brandon Judd's Technical Documents
Brandon Judd's Blog Posts
Time Required for Refrigerated Flux and Solder Paste to Reach Room Temperature
One question that I often hear from customers is; “Once out of the refrigerator, how long do I have to wait to allow my solder paste and/or flux to reach room temperature in order to use it?” It is indeed very important for solder pastes and fluxes to be at ambient temperature (approximately…
Variables in the Package-on-Package Process
When designing a Package-on-Package (PoP) assembly process, there are many variables that need to be considered in order to be successful. While the chemistry of your PoP dipping flux or paste plays a major role in PoP assembly, there is also much to consider in terms of the components, equipment,…
Solder Paste/Preform Bond Line Thickness
When helping customers with the optimization of their soldering process, the question often comes up; “What will my solder bond line thickness be when utilizing this material?” The amount of volume lost to flux content while utilizing a solder paste, in comparison to a flux-coated…