circuit board

Brook Sandy-Smith

Brook Sandy-Smith

Technical Support Engineer for PCB Assembly Materials

Indium Corporation
Phone: +1 (315) 853-4900
E-mail: bsandy@indium.com
Address: 34 Robinson Rd., Clinton, NY USA 13323

Blog

Brook Sandy-Smith's Blog

Biography

Watch Brook Sandy's Water Soluble Pastes Video

Brook is a Technical Support Engineer for PCB Assembly Materials in Indium Corporation’s Solder Products Business Unit. She acts as a technical liaison between our customers and internal departments, such as R&D and production, to insure the best quality and selection of products. She also provides support in improving informational materials to assist PCB assembly materials customers.

Brook attended the University of Rhode Island in the International Engineering Program, and earned degrees in Chemical Engineering (with a focus on materials) and German Language. While at URI, Brook worked as a research assistant in the Sensors and Surface Technology partnership, doing research on metallized thin polymer films for IR imaging applications. She also spent a year in Germany studying at the Technical University of Braunschweig and completing an internship focusing on thermo-analytical analysis.

Brook previously worked in R&D, developing conductive adhesives for die- and strap-attach, as well as conductive inks for RFID applications. Her areas of expertise include analytical testing of conductive materials, applications such as screen printing and jet dispensing (jetting), as well as scale-up and pre-production of developmental materials.

Brook Sandy-Smith's Blog Posts

SMTA International 2017: Warpage-Induced Defects & Component Warpage Limits Panel Discussion

06 Sep 2017 by Brook Sandy-Smith [view bio]

Brook Sandy-Smith will chair a panel on Warpage-Induced Defects & Component Warpage Limits at SMTAI 2017

Read More

Join Indium Corporation® at SMTA Empire 2017

07 Jun 2017 by Brook Sandy-Smith [view bio]

SMTA Empire's Expo and Tech Forum on June 15, 2017, in Syracuse, New York.

Read More

Bottom Termination Components Design Panel at ICSR 2017

30 May 2017 by Brook Sandy-Smith [view bio]

Brook Sandy-Smith will be moderating the Bottom Termination Components Design Panel at ICSR 2017.

Read More

View All Blog Posts

Other Ways to Contact Indium

Indium Corporation has manufacturing capabilities, technical support, sales offices, and representatives world-wide who are committed to providing the very best support. Please select your region for customer support information.

From One Engineer to Another®

All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.

Indium Corporation uses cookies to provide you with the best possible experience on our website. By using our website, you agree to the placement of cookies on your device.
Read more about our use of cookies here.