Product Manager PCB Assembly Materials
Phone: +1 (315) 853-4900 x7521
Mobile: +1 (315) 842-6665
Address: 34 Robinson Rd., Clinton, NY USA 13323
- 6 Sigma Green Belt
Chris is the Product Manager for Indium Corporation’s PCB Assembly Materials. With an intimate understanding of customer needs and challenges, he works closely with Indium Corporation’s R&D team to deliver fully scaled, launched, marketable product solutions for PCB Assembly solder pastes and epoxy-based products. Chris also provides comprehensive technical advice in the selection, use, and application of solder paste and flux to electronics assembly customers throughout the world. He is responsible for ensuring the product line is poised for future growth to best meet the needs of existing and potential customers.
Chris joined Indium Corporation in 2005. He has authored numerous process and technical guidelines and has presented at numerous industry forums and conferences. He is a member of the SMTA and participates in the occasional IPC standards development committee.
Chris has bachelor’s degree from Clarkson University. He is certified as a Six Sigma Green-Belt from Dartmouth College’s Thayer School of Engineering and has earned his certification as an SMTA Process Engineer.
Christopher Nash's Technical Documents
Christopher Nash's Blog Posts
Vacuum Reflow can help reduce voiding in SMT assembly but the process varies from conventional convection reflow. Here's how to achieve the best results possible.
Learn about the many factors associated with BTC voiding reduction.
In a previous blog I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa Diagram. This tool helps map out a process and provide an excellent visual aid that helps show the potential defect causes and the effects the process variables can have. This particular Ishikawa Diagram displayed that reflow profile can have a large effect on voiding. Today I will dig into this area a bit further and talk about how we can minimize large ground plane solder voiding in electronic assemblywith differences in reflow profile.
From One Engineer to Another®
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