Ed Briggs
Technical Support Engineer, Southeast USA and Eastern Canada
Indium Corporation
Phone: +1 315 853 4900 x7594
E-mail: ebriggs@indium.com
Address: 1676 Lincoln Ave., Utica, NY, USA 13502
- Certifications:
- SMTA
- IPC-A-610D
- IPC-A-600
- Green Belt
Blog
Biography
Ed Briggs is a technical support engineer for the Southeast United States and Eastern Canada. He joined Indium Corporation in 1992 and has held a variety of positions in production and technical support.
Ed is an SMTA-certified engineer, and earned his green belt six-sigma certification from Dartmouth College for demonstrating proficiency in developing and executing design experiments to support continuous process improvement.
Ed has an associate’s degree in chemical technology from Mohawk Valley Community College, where he won the Douglas J. Bauer Award for Excellence in Chemistry. He has authored six technical papers and has presented at several technical conferences throughout North America.
Ed Briggs's Technical Documents
Ed Briggs's Blog Posts
SMT Reflow Process Window: Solder Paste Maximum Slope vs. Ramp (or Average) Rate
Included in a solder paste's Product Data Sheet, among other things, are general guidelines which aid the customer in designing an SMT reflow profile. The data sheet gives general recommendations, for time above liquidus, peak temperature, and ramp rate.Example: Figure 1: Example…
Transitioning from Water-Soluble Solder Paste Flux to No-Clean Solder Paste Flux
I just visited a customer that was converting from water soluble solder paste to no-clean. Not exactly a slam dunk transition as this customer found out. During my visit, solder balls and solder beads were observed in the no-clean flux residue adjacent to discrete components (capacitor/resistors). These…
SMT Components "Blowing-Off" PCB
Recently I was at a customer who reported that their SMT components were “blowing off” their PCB. In most of the instances the component was still on the PCB but completely off pad.Further investigation showed that the solder paste print for the component was well defined and that the component,…
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