Senior Technical Support Engineer
Phone: +1 315 853 4900 x7594
Address: 1676 Lincoln Ave., Utica, NY, USA 13502
- Green Belt
Ed Briggs is a technical support engineer for the Southeast United States and Eastern Canada. He joined Indium Corporation in 1992 and has held a variety of positions in production and technical support.
Ed is an SMTA-certified engineer, and earned his green belt six-sigma certification from Dartmouth College for demonstrating proficiency in developing and executing design experiments to support continuous process improvement.
Ed has an associate’s degree in chemical technology from Mohawk Valley Community College, where he won the Douglas J. Bauer Award for Excellence in Chemistry. He has authored six technical papers and has presented at several technical conferences throughout North America.
Ed Briggs's Technical Documents
Ed Briggs' Blog Posts
Square with Radius Corners vs. Circular Apertures: SMT Optimization for Success Part 4:
In our continued investigation and quest to improve solder paste printing for fine-feature paste deposits, we also found that consistency (low standard deviation) favored the square apertures when comparing circular apertures to square apertures with radius corners (hereafter referred to only as square…
SMT Optimization for Success Part 3: Flux Chemistry
SMT Optimization for Success Part 3: Flux Chemistry In our continued discussion on optimizing the stencil printing process (see Part 1, Part 2), the type of flux chemistry, specifically water-soluble vs. no-clean, also plays a significant role. Solder pastes are sensitive to the environment to which…
Stencil Printing for SMT Assembly Success Part 2: Print Metrics
(See Part 1) When discussing success in solder paste stencil printing for SMT assembly, one of the most important tools in an engineer‘s “belt” is his solder paste inspection (SPI) equipment. This is especially important for smaller stencil apertures/paste deposits that are difficult…
From One Engineer to Another®
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