Senior Technical Support Engineer
Phone: +1 315 853 4900 x7594
Address: 1676 Lincoln Ave., Utica, NY, USA 13502
- Green Belt
Ed Briggs is a technical support engineer for the Southeast United States and Eastern Canada. He joined Indium Corporation in 1992 and has held a variety of positions in production and technical support.
Ed is an SMTA-certified engineer, and earned his green belt six-sigma certification from Dartmouth College for demonstrating proficiency in developing and executing design experiments to support continuous process improvement.
Ed has an associate’s degree in chemical technology from Mohawk Valley Community College, where he won the Douglas J. Bauer Award for Excellence in Chemistry. He has authored six technical papers and has presented at several technical conferences throughout North America.
Ed Briggs's Technical Documents
Ed Briggs' Blog Posts
The Largest Trade-off in Printing UltraFine Solder Pastes is in Reflow
In a six-part SMT assembly series, we discussed the advantages of using fine powder solder pastes to improve process yields for stencil printing, especially in areas where the area ratio is below 0.66. Because ~60% of solder defects typically occur at the printer, it is vital to success to focus on…
SMT Optimization For Success - Part 6: The Effect of Solder Particle Size on Printing Using ...
SMT Optimization for Success Part 6: Solder Paste Particle Size and Its Effect on Stencil Printing Ultra-fine Solder Paste Deposits This final post in a series on the stencil printing aspect of SMT optimization using ultrafine solder paste pulls together everything we have discussed previously as…
Optimization for Success: Solder Mask Defined vs. Copper Defined Non-Solder Mask Defined) Pads
Part 5: Solder Mask Defined vs. Copper Defined (Non-Solder Mask Defined) Pads Figure 1. In the last discussion we statistically evaluated and concluded that square apertures with radius corners provided more consistent (less standard deviation) paste deposits than circular apertures of the…