Phone: +1 (315) 853-4900 x2346
Address: 111 Business Park Drive, Utica, NY 13502
Jim is a Manufacturing Engineer for Indium Corporation, supporting Indium’s engineered solder materials. He is responsible for providing engineering support for the manufacturing cells at our Business Park facility, which includes interfacing with product management, quality, and sales. He helps identify and implement process improvements by providing insight and expertise on how Indium Corporation’s products are used and how they perform.
Jim joined Indium Corporation in 2005 as an Applications Engineer for semiconductor packaging materials. Most recently, he was an Applications Engineer for solar assembly products and NanoFoil®. Jim has presented at industry organizations and technical seminars globally, and has authored technical papers and blog posts on a number of topics, including thermal management, semiconductor grade flux technology, solder materials testing, and sputtering target bonding.
Prior to joining Indium Corporation, Jim was a Mechanical Engineer at Fiber Instrument Sales where he designed and patented a new fiber optic sensor. He also redesigned a fiber optic cleaver to lower production costs while providing longer service life and lower splice attenuation.
Jim has a bachelor’s degree in mechanical engineering technology from the State University of New York’s Institute of Technology. In his spare time he studies philosophy and enjoys learning techniques of homesteading.
Jim Hisert's Technical Documents
Jim Hisert's Blog Posts
Metal thermal interface performance is affected by pressure; we have a way to optimize performance using lower pressure.
How indium is used in many nuclear power plants.
The reclaim/recycling aspect of both rotary and planar indium-containing sputtering targets.
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.