Jim Hisert
Applications Engineer, Thin-Film & Solar
Indium Corporation
Phone: +1.315.853.4900 x759
E-mail: jhisert@indium.com
Address: 1676 Lincoln Ave., Utica, NY USA 13502
Blog
Biography
Jim is an Applications Engineer for Indium Corporation, supporting Indium's materials for the photovoltaic industry. Like many other engineers in the solar industry, his background is in the semiconductor industry. Jim has presented at various industry organizations and technical seminars, and has authored technical papers on thermal management, as well as semiconductor packaging assembly.
Jim is an active member of photovoltaic standards organizations, including the IPC, for which he chairs a subcommittee, "Acceptance Criteria for Tabbing and Stringing".
Previous to his time with Indium Corporation, Jim was a mechanical engineer at Fiber Instrument Sales where he designed and patented a new fiber optic sensor. This position helped give him the vision of a process/design engineer, which has allowed him to better connect with his current customers.
He has a bachelor's degree in Mechanical Engineering Technology from the State University of New York's Institute of Technology. He is a member of the American Society of Mechanical Engineers.
Jim Hisert's Technical Documents
Jim Hisert's Blog Posts
Bonded Sputtering Targets are a Bi-Metallic Assembly
Whenever two materials with different coefficient of thermal expansion values are bonded together, they will expand and contract as the temperature changes. Assuming these two materials are bonded rigidly, there are two things that can happen as the temperature changes: 1) the bond will break apart…
NanoBond® is a Fluxless Process
Fluxes are an interesting element of working with many solder applications. With so many specialized fluxes there is usually a perfectly-tailored flux for removing oxides from any solderable surface. Even though we love fluxes at Indium Corporation – not all of our customers share that same affection. It…
High Temperature (Braze Alloy) Sputtering Target Bonding, with NanoFoil®
In an earlier post I mentioned one of the presentations we gave at the 2013 SVC TechCon. The other presentation that our team delivered at the show (presented by Jacques Mateau) regarded another very interesting topic. The paper, High Temperature, Pb-Free, Metallic Sputtering Target Bonding…
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