Applications Engineer, Thin-Film & Solar
Phone: +1.315.853.4900 x759
Address: 1676 Lincoln Ave., Utica, NY USA 13502
Jim is an Applications Engineer for Indium Corporation, supporting Indium's materials for the photovoltaic industry. Like many other engineers in the solar industry, his background is in the semiconductor industry. Jim has presented at various industry organizations and technical seminars, and has authored technical papers on thermal management, as well as semiconductor packaging assembly.
Jim is an active member of photovoltaic standards organizations, including the IPC, for which he chairs a subcommittee, "Acceptance Criteria for Tabbing and Stringing".
Previous to his time with Indium Corporation, Jim was a mechanical engineer at Fiber Instrument Sales where he designed and patented a new fiber optic sensor. This position helped give him the vision of a process/design engineer, which has allowed him to better connect with his current customers.
He has a bachelor's degree in Mechanical Engineering Technology from the State University of New York's Institute of Technology. He is a member of the American Society of Mechanical Engineers.
Jim Hisert's Technical Documents
Jim Hisert's Blog Posts
Indium preforms offer very precise volumes of solder, and are cut to fit some very interesting bond-line shapes. Some examples of preform applications are: bonding lids on sealed packages, thermal interfaces, and custom cut cryogenic sealing gaskets. We even know how to make a boring old rectangular…
Indium ribbon can be made to various widths and thicknesses. It may also be called "foil" if it is over 4 inches wide. It is easily cut to form shapes for prototyping or small-scale production. In fact, we use a large amount of indium ribbon to make preforms for our customers. Using a material…
Indium wire is very different than the solder wire you find in hardware stores. To me, it’s like comparing a sports car and a go-kart. Each perform differently, are made for a very different set of uses. Indium wire is used for many unique purposes, such as sputtering target bonding (soldering),…
From One Engineer to Another®
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