Phone: +1.315.853.4900 x759
Address: 1676 Lincoln Ave., Utica, NY USA 13502
Jim is an Applications Engineer for Indium Corporation, supporting Indium's materials for the photovoltaic industry. Like many other engineers in the solar industry, his background is in the semiconductor industry. Jim has presented at various industry organizations and technical seminars, and has authored technical papers on thermal management, as well as semiconductor packaging assembly.
Jim is an active member of photovoltaic standards organizations, including the IPC, for which he chairs a subcommittee, "Acceptance Criteria for Tabbing and Stringing".
Previous to his time with Indium Corporation, Jim was a mechanical engineer at Fiber Instrument Sales where he designed and patented a new fiber optic sensor. This position helped give him the vision of a process/design engineer, which has allowed him to better connect with his current customers.
He has a bachelor's degree in Mechanical Engineering Technology from the State University of New York's Institute of Technology. He is a member of the American Society of Mechanical Engineers.
Jim Hisert's Technical Documents
Jim Hisert's Blog Posts
Reflow Profiling, Electrical Reliability, No-Clean Solder Paste Flux Residues
It sounds bad for me to say this, but I have a lot of SMT magazines cross my desk and, honestly, the solder paste articles rarely draw my interest. I work in a world of solder preforms and that’s really where my mind is at, currently. A recent exception is a paper written by Eric Bastow (Assistant…
Making Solder Preforms
Once an order is placed for the solder preforms you have specified, Indium Corporation begins the manufacturing process promptly; we have a lot of steps to go through and want to get you the parts quickly! We begin with raw materials that need to go through all or most of the following steps: Alloying Extrusion…
Industry Trend - Underwater Soldering
As more and more of the electronics industry moves toward (SMA) Subaquatic Microelectronics Assembly, questions have arisen regarding safety aspects, solder joint quality, and reflow profiling. We believe all 3 of these concerns can be resolved by using NanoFoil®. Happy April fool’s…