Phone: +1.315.853.4900 x759
Address: 1676 Lincoln Ave., Utica, NY USA 13502
Jim is an Applications Engineer for Indium Corporation, supporting Indium's materials for the photovoltaic industry. Like many other engineers in the solar industry, his background is in the semiconductor industry. Jim has presented at various industry organizations and technical seminars, and has authored technical papers on thermal management, as well as semiconductor packaging assembly.
Jim is an active member of photovoltaic standards organizations, including the IPC, for which he chairs a subcommittee, "Acceptance Criteria for Tabbing and Stringing".
Previous to his time with Indium Corporation, Jim was a mechanical engineer at Fiber Instrument Sales where he designed and patented a new fiber optic sensor. This position helped give him the vision of a process/design engineer, which has allowed him to better connect with his current customers.
He has a bachelor's degree in Mechanical Engineering Technology from the State University of New York's Institute of Technology. He is a member of the American Society of Mechanical Engineers.
Jim Hisert's Technical Documents
Jim Hisert's Blog Posts
Applying Solder Preforms
OK! We’ve discussed specifying solder preforms and making solder preforms, although none of that is important until we actually use the preforms for something. Solder preforms can be used as a mechanical, thermal, or electrical connection. In the following posts we will look at what goes into the…
Applying Solder Preforms – Compression
Most people think of our alloys only in the ‘soldering’ sense. However, these same materials may be used in applications where they aren’t designed to melt and attach components. Four common uses for solder alloys that are not soldering applications are: Fusible plugs or links (these…
Applying Solder Preforms – Heating (with Guest Star Brandon Judd)
For this week’s World of Solder Preforms series installment, Brandon Judd explains the importance of reflow profiling: Solder preforms are a very common method of reducing voiding in a soldered device with larger X/Y dimensions. Compared to solder paste (which is approximately 50% flux by…