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Mario Scalzo

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Mario Scalzo

Senior Technical Support Engineer

Indium Corporation
Phone: +1 315 853 4900 x7542
E-mail: mscalzo@indium.com
Address: 34 Robinson Rd., Clinton, NY USA 13323

  • Certifications:
  • SMTA
  • IPC-A-610D
  • IPC-A-600
  • Black Belt

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Mario Scalzo's Blog

Biography

Mario Scalzo is a Senior Technical Support Engineer at the Indium Corporation.

Mario is responsible for providing technical support for advanced SMT process issues, special assignments involving key customer-related projects, product education, and process training of new employees.

Mario joined Indium Corporation in 2000 as a Quality Flux Technician. He spent two years as a Quality Engineer, which gave him a depth of knowledge beyond the normal product training and taught him to anticipate customer concerns. In his most recent position as a Technical Support Engineer, Mario worked closely with the Asian and North American regional teams. He spent 6 months in Singapore on a long-term assingment to provide training and support in Singapore, Malaysia, Taiwan, and China.

Mario Scalzo's Wife Carrie

Mario has a bachelor’s degree in Chemistry from Saint Anselm College and has a certificate from the American Chemical Society for Professional Education. He is an SMTA Certified Process Engineer and has a Six-Sigma Black Belt certification from Dartmouth College’s Thayer School of Engineering. Mario is active in several industry organizations such as the SMTA and the American Chemical Society, and has made technical presentations in North America and Asia.

Mario enjoys sport motorcycling, bicycling, Jeeping, and camping. He and his wife, Carrie, have been married since December 2007.

Watch Mario's Bio Video

Mario Scalzo's Technical Documents

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Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly (Chinese)

Authors: Mario Scalzo

Posted on 11 Mar 2010

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Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly (English)

Authors: Mario Scalzo

Posted on 11 May 2009

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Aiming for High First-pass Yields in a Lead-free Environment

Authors: Mario Scalzo

Posted on 3 Mar 2010

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Defect Elimination Through Process Refining and Proper Material Choice

Authors: Mario Scalzo

Posted on 4 Mar 2010

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Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering

Authors: Mario Scalzo, Todd O, Todd O'Neil

Posted on 11 Apr 2011

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Room Temperature LED and D-Pak Type Component-Attach and Reliability Testing

Authors: Mario Scalzo, Thomas Acchione

Posted on 17 Mar 2011

Mario Scalzo's Blog Posts

Silver-free and Low-Silver Solder Alloys for SMT Discussion, Part 1: Reliability

Thursday, May 19, 2011

There seems to be a growing trend to use a low-Ag or Ag-free solder alloy for Surface Mount Technology (SMT) electronics assembly, similar to what is commonly offered for bar solder, used in wave and selective soldering.For through-hole performance, the strength and stability come from the entire barrel…

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Wave Solder Flux Deactivation Temperatures Explained

Monday, January 17, 2011

The "wave soldering flux deactivation temperature question" arises every few weeks, and the easy answer is that wave solder fluxes are designed to see the temperature of the wave.Now, in order to pass SIR testing, the test boards with the wave fluxes are sent through the wave pattern up, not…

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Will Multiple Reflows Damage My Solder Joint?

Wednesday, January 12, 2011

I just received a customer inquiry regarding a phenomenon that is little studied and even less quantified; “How many times can I reflow a solder alloy before damaging the solder joint?”As you may already know, each time you bring a solder alloy above its liquidus temperature, it continues…

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