Vice President of Technology

Indium Corporation
Phone: +1 315 853 4900 x7613
E-mail: nclee@indium.com
Address: 34 Robinson Rd, Clinton, NY USA 13323

Biography

Dr. Ning-Cheng Lee is the Vice President of Technology of Indium Corporation. In addition, he is also an SMTA Member of Distinction.

Dr. Lee has been with Indium Corporation since 1986. Prior to joining Indium, he was with Wright Patterson Air Force Base Materials Laboratory, Morton Chemical, and SCM. Dr. Lee has two decades of experience in the development of fluxes and solder pastes for SMT industries.

His accomplishments include:

• International liaison to the SMTA Taiwan chapter.
• Author of Reflow Soldering: Processing and Troubleshooting SMT, BGA, CSP and Flip-Chip Technologies, 5-star rated on Amazon.com.
• Co-author of Electronics Manufacturing with Lead-Free, Halogen-Free, & Conductive-Adhesive Materials, 5-star rated on Amazon.com.
• Numerous “Best of Conference” papers, worldwide.
• Chairman of several technical sessions, worldwide.
• Extensive success in the development of high-temperature polymers.
• Developed revolutionary solder paste and flux formulations.
• Created and introduced the “Lee” SMT reflow profile.
• Explored and developed the complex mechanisms of soldering wetting, void formation, tombstoning, solder-balling, and solder-beading.

Dr. Lee has 20 years of experience in the development of fluxes and solder pastes for SMT applications. In addition, he also has very extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.

Dr. Lee received his Ph.D. in polymer science on structure-property relationships from the University of Akron in 1981, and a BS in chemistry from the National Taiwan University in 1973. He also studied Organic Chemistry at Rutgers University. He has served on the advisory boards of Soldering and Surface Mount Technology and Global SMT and Packaging magazines.

Books

• Electronics Manufacturing: with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials
• Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP and Flip Chip Technologies

Dr. Lee and Ross Berntson accepting the prestigious Vision Award for the revolutionary NF260 no-flow underfill.

Sharing a light moment in the halls of the Indium Corporation.

Dr. Lee in Shenzhen during a Pb-Free soldering class.

Dr. Lee served on the 2004 SMTAI International Technical Committee.
(image © copyright SMTAI)

Dr. Lee shopping for durian in Singapore.

Dr. Lee paying a visit to West Lake in Hungzhou.

Featured on the cover of EM China Magazine.

Dr. Ning-Cheng Lee's Technical Documents