Vice President of Technology
Phone: +1 (315) 853-4900 x7613
Address: 34 Robinson Rd, Clinton, NY USA 13323
Ning-Cheng Lee, Ph.D., has been with Indium Corporation since 1986, and is Vice President of Technology. He has more than three decades of experience in the development of fluxes, alloys, and solder pastes for SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nano bonding technology and thermal conductive materials.
Dr. Lee is the author of Reflow Soldering Processes and Troubleshooting: SMT, BGA, CSP, and Flip Chip Technologies (Newnes), and co-author of Electronics Manufacturing with Lead-Free, Halogen-Free, and Conductive-Adhesive Materials (McGraw-Hill); both of which have achieved a 5-star rating on Amazon.com. Dr. Lee has also authored book chapters for several additional lead-free soldering books.
Dr. Lee has been recognized by numerous industry organizations for his research, including:
- Founder’s Award (2015) - the SMTA’s highest honor
- Distinguished author (2009)
- Member of Distinction (2002)
- International liaison to the Taiwan Chapter
- IEEE Fellow (2016)
- Senior Member (2015)
- Electronic Manufacturing Technology Award (2010)
- Distinguished Lecturer (2007)
- Exceptional Technical Achievement Award (2006)
- Soldertec: Lead-Free Co-Operation Award (2003)
Dr. Lee has published articles in numerous industry publications and is frequently an invited speaker for presentations, seminars, keynote speeches, and short courses worldwide, many of which have been recognized with “Best of Conference” awards.
Prior to joining Indium, Dr. Lee worked for Wright Patterson Air Force Base Materials Laboratory, Morton Chemical, and SCM. He received his Ph.D. in polymer science from the University of Akron in 1981, and his bachelor’s degree in chemistry from the National Taiwan University in 1973. Dr. Lee serves on the board of governors for CPMT and is a past director of the SMTA. Among other editorial responsibilities, he serves on the editorial advisory board of Soldering and Surface Mount Technology and Global SMT and Packaging, and is an associate editor for the IEEE Components Packaging Manufacturing Technology.
"Since the inception of SMT, Dr. Ning-Cheng Lee has been a driving force in removing the 'art' of SMT assembly and replacing it with science. We can think of no single individual who has contributed more to the technical development of this most important technology than Dr. Lee." - SMTA Awards Program