Indium Corporation's Semiconductor Assembly Materials Product Manager, Andy C. Mackie, Ph.D., has joined the editorial board of Chip Scale Review.
Dr. Mackie will work in conjunction with the other editorial board members and Chip Scale Review's editorial team in selecting editorial topic ideas, verifying editorial content of articles, and authoring editorial for the publication.
According to Terrence Thompson, Editor, Chip Scale Review, "It's an honor to have Andy on the advisory board. He is a well-known industry expert and his insights will make Chip Scale Review a better publication for our customers."
Dr. Mackie has a Ph.D. in physical chemistry from the University of Nottingham, UK, and a master of science degree in surface and colloid chemistry from the University of Bristol, UK. Dr. Mackie is trained in Six Sigma "Design of Experiments" and has written numerous papers that have been published globally.
Dr. Mackie has over 19 years of experience in new product development, sales, and marketing for electronics assembly and semiconductor packaging. He is an industry expert in solder paste printing, reflow, and atmosphere control in electronics assembly. In 2001, he received the IPC President's Award for his leadership in IPC's Solder Paste Task Group and the Assembly and Joining Materials Subcommittee.
Chip Scale Review is produced for a worldwide audience of engineers, specialists, researchers and end-users of chip-scale and wafer-level back-end electronics manufacturing in print and digital editions. Chip Scale Review covers the chip-scale, flip-chip, and wafer-level packaging market.
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a five-time Frost & Sullivan Award winner and registered to ISO-9001.
For more information about Chip Scale Review, visit http://www.chipscalereview.com.