Indium Corporation expert Dr. Ning-Cheng Lee will present his technical findings at the 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2011) August 8-11, in Shanghai, China.

Dr. Lee will present A Novel High Melting Lead-Free Mixed Solder Paste System. This paper, which is co-authored by Research Metallurgist Hongwen Zhang, discusses the development of a novel high melting lead-free BiAgX® mixed solder paste system, and compares the performance with several representative high lead solder alloys.

Dr. Lee will also be presenting the technical poster Fragility Suppression Via BGA with SAC105Ti Ball, which is co-authored by Research Metallurgist Weiping Liu. This poster discusses the drop test performance of different solder combinations.

Dr. Lee will also be teaching a professional development course, Achieving High Reliability of Lead-free Soldering and Flip Chip 3D/TSV Packaging & Materials Consideration and chairing the session Packaging Materials & Processes.

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership.

For more information about ICEPT-HDP 2011, visit

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

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