Two of Indium Corporation's technology experts will present their technical findings at NEPCON China (Shanghai) in Shanghai, China, May 11-13, 2011. Aaron Yan, (严俊杰), Senior Technical Support Engineer, will be presenting Soldering Challenges in a Halogen-Free PCB Assembly Process (无卤PCB装配工艺中的焊接挑战). This paper discusses how to be successful in implementing halogen-free fluxes and solder pastes, as well as the techniques and practices that help ensure high end-of-line yields and continued reliability. Wisdom Qu, (瞿艳红), Assistant Technical Manager, will be presenting the paper Fine Feature Stencil Printing 0.3mm Pitch Components (0.3mm间距元件的钢网印刷特性). This paper explores evaluations done on the capability of the stencil printing process to obtain consistent solder paste print volumes when printing fine feature components. Both papers were originally presented at the 2009 SMTA International Conference on Soldering and Reliability in Toronto, Canada. Aaron Yan provides technical support for Indium's electronics assembly materials, semiconductor and advanced assembly materials, and engineered solders and thermal management materials. He uses his expertise to help customers optimize their manufacturing processes. Aaron has a bachelor's degree in Industry and Commerce Administration from Suchow University in China. He has over ten years of experience in surface-mount technology and has been a technical support engineer with Indium Corporation since 2006. He is based in Suzhou, China. Wisdom Qu provides technical support for Indium Corporation's electronics assembly materials, semiconductor and advanced assembly materials, and epoxy flux products. Wisdom has over nine years of experience in surface-mount technology and in 2007, was recognized by Indium Corporation for her expertise with the Silver Quill Award for Best Paper/Presentation of the year. Wisdom has presented at several technical conferences and customer sites. She is based in Suzhou, China. Wisdom has a degree in mathematics from Hubei Radio and Television University in China. She is an SMTA Certified Process Engineer. Indium Corporation will be exhibiting at 2E06. For more information about NEPCON China and the technical conference, visit http://www.nepconchina.com. Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA. For more information about Indium Corporation, visit www.indium.com or email email@example.com.
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