Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology, and Sehar Samiappan, area technical manager for North Malaysia, the Philippines, and Vietnam, will present at the 35th International Electronics Manufacturing Technology Conference November 6–8 at the Kinta River Front Hotel, Ipoh, Perak, Malaysia.
Sehar's paper, The High-Melting, Lead-Free, Mixed BiAgX Solder Paste System, explains the research involved in identifying lead-free alternatives for high-melting, high lead-containing solder alloys. The presentation also discusses a novel high-melting, lead-free, BiAgX® mixed solder paste system, and compares its performance to several representative high lead-containing solder alloys. Sehar will present on November 8. The paper is available for download from Indium Corporation's technical library located at http://goo.gl/I4b3M.
In addition, Dr. Lee, a world-renown expert in soldering technology, will be teaching a professional development course on Achieving High Reliability Lead-Free Solder Joints on November 6.
Sehar provides field technical support to Indium Corporation's customers. He conducts process evaluations, product trainings, designs of experiments (DOEs), and helps diagnose productivity issues in the factories. Sehar is an electrical engineer with over 18 years of experience, mainly in the area of process, failure analysis, and production. He is an SMTA-certified process engineer and has earned his Six Sigma Green Belt.
Dr. Lee has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, microelectronics encapsulants, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is an SMTA Member of Distinction and a member of the SMTAI planning committee.
The IEMT conference is the premier Institute of Electrical and Electronics Engineers (IEEE) event devoted to the manufacture of electronics, opto-electronics, and MEMS/sensors devices and systems. IEMT is an established international conference, organized by the Components Packaging and Manufacturing Technology (CPMT) Society of IEEE. IEMT 2012 is being organized by the IEEE CPMT Malaysia Chapter with co-sponsorship from CPMT's Santa Clara Valley Chapter.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, germanium and tin compounds, and high purity metals; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.