Indium Corporation’s Bernard Leavitt, Product Specialist, High-Temperature Applications, will present at IMAPS High Temperature Electronics Network 2017 (HiTEN 2017), July 10-12 in Cambridge, United Kingdom.

Leavitt’s presentation, Die-Attach Voiding Reduction in Gold Alloy Solder Preforms, discusses the changing requirements of high-temperature solders in RF and power semiconductor device assembly, as both power density and ratings of these devices increase. AuSn20 (Indalloy®182) has been the workhorse for high-temperature, high-reliability, small die-attach applications for many years. However, the gold-tin eutectic solder alloy is beginning to reach its utility limit. Leavitt will review the next options available to RF and power semiconductor manufacturers.

Leavitt is responsible for promoting and growing Indium Corporation’s product line for high-temperature applications. He works with the sales teams to identify current and potential customer accounts, and handles customer communications and product inquiries. Leavitt joined Indium Corporation in 2007. In 2010, he was promoted to Account Coordinator responsible for relationship management. Leavitt attended the State University of New York at Morrisville and earned his bachelor's degree in Business Management from the State University of New York's Empire State College.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.