Indium Corporation’s Sze Pei Lim, Semiconductor Product Manager – Asia, will present at the 13th International Wafer-Level Packaging Conference (IWLPC 2016 – Bridging the Interconnect Gap), Oct. 18-20, in San Jose, Calif.
Lim’s presentation, System-in-Package (SiP) Assembly vs. Solder Paste Attributes, addresses the increased demand for SiP due to the rapid development of Internet of Things (IoT) “smart” devices. The continued push toward miniaturization creates a demand for assemblies with smaller components and greater density. Lim will focus on the attributes of fine powder size solder pastes, review the tests conducted for critical-to-function characteristics, and discuss the results.
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore and has 17 years of experience in the SMT and PCB assembly industries. She is an SMTA-certified process engineer and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.