Vijay will present Improve Reliability and Bondline Control with InFORMS® and Indalloy®276. The paper presents a novel method of achieving bondline control through the use of InFORMS®, a composite fabrication consisting of solder and a reinforcing matrix that stabilizes bondline thickness.
Vijay is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the SMTA, and has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from the State University of New York at Binghamton.
To speak with Vijay in person, come visit our stand at PCIM #7-528 or email firstname.lastname@example.org. You can also visit our technical library at www.indium.com/techlibrary.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.