Indium3.2HF is an air or nitrogen reflow, water-soluble solder paste targeted at system-in-package (SiP) devices for the Internet-of-Things (IoT). It is specifically formulated to Avoid the Void® by achieving exceptionally low voiding performance on ultra-fine-pitch components, including BGAs and CSPs.
Indium3.2HF accommodates the higher processing temperatures required by the SnAgCu, SnAg, SnSb, and other Pb-free alloy solder systems. Its unique formulation offers consistent, repeatable printing performance combined with a long stencil life and sufficient tack strength to handle the challenges of today’s high-speed and high-mix surface mount production lines. For larger passive devices, such as the decoupling capacitors used in many standard logic flip-chip applications, the paste reflows without creating large solder balls that can move under the logic die and cause electrical shorting.
In addition to consistent printing and reflow requirements, this solder paste offers superb wetting to the various Pb-free metallizations.
For more information about how to Avoid the Void® with Indium Corporation’s line of low-voiding materials, visit booth 1220 in Hall E1 at Productronica China, or go to www.indium.com/avoidthevoid.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.