Indium Corporation will feature its reinforced solder alloy fabrications, InFORMS®, at APEC 2017, March 26-30, in Tampa, Fla.

InFORMS are reinforced solder preforms that increase lateral strength and stability. As a result, improved thermal cycling reliability can be achieved.

In one study where InFORMS were used to solder a DBC to the baseplate of an IGBT, the following were achieved:

  • 4x improved thermal cycling reliability compared to a solder preform-only approach
  • 2x improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
  • Low-voiding of <1%
  • Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment

For more information about InFORMS, visit www.indium.com/informs or visit Indium Corporation at booth #525.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.