Indium Corporation will feature its reinforced indium and solder alloy fabrications, InFORMS®, at IMAPS 49th International Symposium on Microelectronics (IMAPS 2016 - Packaging the Connected World), Oct. 10-13, in Pasadena, Calif.

InFORMS are reinforced solder preforms that maintain a constant bondline thickness, thus significantly improving thermal cycling reliability. This is a key requirement in many applications, including die-attach and baseplate-attach for IGBTs.

In one study where InFORMS were used to solder a DBC and baseplate of an IGBT, the following was achieved:

  • 4X improved thermal cycling reliability compared to a preform-only approach
  • 2X improved thermal cycling reliability compared to a preform + Al wirebond stitch approach
  • Low-voiding of <1%
  • Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment

InFORMS provide engineers with an enhanced material for the development of new, or the improvement of existing, applications. For more information about InFORMS, visit www.indium.com/inform or visit Indium Corporation at booth #710.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.