Indium Corporation will feature its ultra-low voiding Indium10.1HF Solder Paste—which helps customers Avoid the Void®—at the SMTA International Technical Conference, Sept. 17-21, in Rosemont, Ill.

Indium10.1HF is an air reflow, no-clean, halogen-free, Pb-free solder paste specifically formulated to achieve ultra-low voiding, especially in bottom termination component (BTC) assemblies.

The flux chemistry is specifically engineered to improve reliability with:

  • High ECM performance under low standoff components
  • Outstanding solder beading
  • Very low bridging, slump, and solder balling
  • Resistance to head-in-pillow
  • Excellent wetting to a variety of common fresh and aged metallizations and surface finishes
  • High print transfer efficiency with low variation

Indium10.1HF is compatible with lead-free alloys such as SnAgCu, SnAg, and other alloy systems favored by the electronics industry. This solder paste is halogen-free per IEC 61249-2-21, test method EN14582.

For more information about Indium Corporation's low-voiding solder pastes, visit www.indium.com/avoidthevoid or see Indium Corporation at booth 517.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.