Lim’s presentation, No-Clean Material for Advanced Packaging Assembly, will detail how semiconductor-grade, ultra-low residue,
no-clean fluxes and solder pastes eliminate the need for multiple cleaning steps in the system-in-package (SiP) assembly process. This process produces devices targeted at smart internet-of-things (IoT) applications. These materials increase yield and reduce the time, cost, and resources needed for the SiP assembly process.
Ultra-low residue no-clean fluxes also help to Avoid the Void™ because the minimal flux residue left behind after soldering is compatible with the underfill or molding material used in encapsulation, thus eliminating the danger of delamination.
Lim has more than 20 years of experience in the PCB assembly and semiconductor packaging industries and is highly respected in her field. She earned her bachelor’s degree in chemistry from the National University of Singapore and has 17 years of experience in the SMT and PCB assembly industries. She is an SMTA-certified process engineer and has a Six Sigma Green Belt. Lim joined Indium Corporation in 2007.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email email@example.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.