Indium Corporation's Pat Ryan, America's Sales Manager, will present Voiding Under Bottom-Terminated Components at the SMTA Space Coast Expo & Tech Forum on Nov. 17 in Melbourne, Fla.

Ryan's presentation will address persistent and costly voiding problems that plague the electronics assembly industry. Topics covered will include the causes and effects of voiding, and new approaches using solder paste chemistries and readily available solder preforms to reduce voiding in BTCs.

Ryan provides strategic direction for Indium Corporation's diverse product, sales, and engineering network. He joined Indium Corporation in 1995 as a sales manager for the Western USA, and has more than 25 years of experience in the manufacturing and engineering fields. Before joining Indium Corporation, Ryan spent 10 years as a Manufacturing Engineering Manager for a medical device manufacturing company. He is an expert in providing solder solutions for customers in the electronics, semiconductor, and thermal management industries. Ryan has a bachelor's degree in mechanical engineering from the University of Portland and presently serves as the SMTA Intermountain Chapter Vice President of Technical Programs.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, thermal management, and solar markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.