Indium Corporation's Karthik Vijayamadhavan is scheduled to present at the European Electronics Assembly Reliability Summit September 21-23, 2010 in Tallinn, Estonia.

The presentation, "Solder Paste Attributes for Maximizing the Print & Reflow Process Windows," focuses on SMT assembly challenges, such as maximizing paste transfer and achieving consistent print deposits for small apertures; eliminating head-in-pillow; and preventing clumpy/grainy solder joints on small components that see long reflow profiles.

Karthik has recently been named Technical Manager for Indium Corporation's European Operations. Prior to his promotion, he was an Area Sales Manager, based in San Jose, CA, USA. He has a bachelor's degree in Mechanical Engineering from the University of Madras-India and a master's degree in Industrial Engineering from the State University of New York at Binghamton.

Karthik is an SMTA-certified engineer and earned his Six Sigma Green-Belt certification from Dartmouth College's Thayer School of Engineering. Karthik has over nine years of experience in the surface mount technology industry. He is based in Milton Keynes, UK.

The European Electronics Assembly Reliability Summit brings together experts and provides a unique opportunity to examine, learn, and debate business-critical issues through industry discussion, technical collaboration, and information sharing.

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about the European Electronics Assembly Reliability Summit, visit http://www.globalsmt.net/ers/wp/.

For more information about Indium Corporation visit www.indium.com or email abrown@indium.com.