Indium Corporation's Vice President of Technology, Dr. Ning-Cheng Lee, will present the paper, Voiding Control for QFN Assembly, at the Pan Pacific Microelectronics Symposium held on the Big Island of Hawaii, January 18-20, 2011.

Voiding Control for QFN Assembly will explore advanced technology solutions for reduced voiding. The paper will be presented as part of session TA2: Materials Advances: Connections Tuesday, January 18th.

Indium Corporation is also a sponsor of the symposium.

Sponsored by the SMTA, the Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world. For more information visit, www.smta.org/panpac/.

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high performance and low cost of ownership. Dr. Lee resides in Clinton, NY.

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.