Indium Corporation’s Jordan Ross, Senior Product Manager – Engineered Solders and Thermal Materials, and Dr. Weiping Liu, Research Metallurgist, will present a workshop on Composite Solder Preforms for High Temperature Pb-free Die Attach on Wednesday, March 20, 2013 at the Semiconductor Thermal Management and Measurement Symposium (Semi-Therm) in San Jose, CA.

High temperature Pb-free solder materials are needed in die-attach, flip-chip packaging, power semiconductor, and optical device packaging. In this workshop, Ross and Liu will discuss a special laminate composite preform specifically developed for high-temperature Pb-free solder applications, where a melting temperature of 280°C or higher is required.

Ross manages Indium Corporation’s most diverse product group: solder preforms, ribbon and foil; thermal interface materials; and Heat-Springs®. He is responsible for product launches and the development and execution of regional and application strategies. Ross has led the effort to bring new products to life, including Indium Corporation’s patented Heat-Spring® thermal interface materials, metal-direct thermal interface materials, (mdTIM), and semiconductor-grade solder preforms and ribbon.

Ross has a bachelor’s degree in Business and Public Management from the State University of New York Institute of Technology. He has presented at numerous industry forums and conferences.

Liu has published over 70 research papers in the area of materials joining and processing, and has received several “best paper” awards at international conferences. He was awarded the American Welding Society's Masubuchi Award in 2004 for "an outstanding scientist under the age of 40 who has made significant contributions in the advancement of the science and technology of materials joining through research and development." He was included in the Marquis Who's Who in America and Marquis Who's Who in Science.

Liu has a PhD in Materials Science and Engineering from the Harbin Institute of Technology.

Semi-Therm is an annual forum for the exchange of the latest technical developments in thermal management of electronic devices, components, and systems. The symposium is dedicated to providing an informal atmosphere, which highlights the latest advances in the field.

Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium metals and compounds; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.