Indium Corporation's Product Support Specialist for PCB Assembly Materials, Brook Sandy-Smith will share her expertise at the SMTA Empire (New York) Expo and Technical Forum on November 8, 2012 at the Radisson Hotel Rochester Airport, in Rochester, NY.
Sandy-Smith's presentation, Proven Approaches to Minimize Voiding under QFNs and other Bottom-Termination Components, discusses the major challenge of eliminating voids underneath components with low standoff. This presentation will explore several approaches to improve assembly of these components, and present results to help optimize thermal performance and reliability.
Sandy-Smith acts as a technical liaison between Indium Corporation customers and internal departments, such as R&D and production, to ensure the best quality and selection of products. Brook attended the University of Rhode Island in the International Engineering Program, and earned degrees in chemical engineering (with a focus on materials) and German language. She also authors a blog, which can be found at blogs.indium.com/blog/brooksandy.
The SMTA Empire Chapter is one in a network of chapters across the United States, South America, the Middle East, and Asia. The volunteer officers and leaders of SMTA Local Chapters plan events serving regional networks of industry professionals. For information on upcoming expos, visit their website at www.smta.org/expos.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, germanium and tin compounds, and high purity metals; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.