Bismuth in many languages1
German: Wismut - r
Bismuth (Bi) is being used more and more as a replacement for lead in solder alloys because it is non-toxic. Although the melting temperature of pure bismuth is 271°C, the addition of bismuth will lower the melting temperature of most metals it is alloyed with. Bismuth compounds are also widely used in medical and cosmetic applications.
- The most popular lead-free bismuth solder alloys are Indalloy® #281 (58Bi 42Sn) which melts at 138°C and Indalloy® #282 (57Bi42Sn1Ag) which melts at 140°C. The addition of the 1% Ag makes the alloy more malleable. Both alloys can be used for step soldering applications. After the initial joints are made with a standard SAC alloy (220°C) subsequent soldering operations can be done using the bismuth alloys.
- Indalloy #281 and #282 have joint properties similar to those of tin-lead solders, with superior fatigue and copper dissolution characteristics.
- Bismuth is the most diamagnetic and the least thermally conductive of all metals
- In addition to being non-toxic it does not oxidize as readily as lead does.
Bismuth Solders Technical Documents
Product Data Sheets
Safety Data Sheets
Bismuth Blog Posts
Folks, Imagine my excitement when Laurence Knight of the BBC contacted me to see if I was interested in being interviewed on the topic of tin pest, with a secondary discussion on tin whiskers. After a 30 minute phone call, it appeared that I passed muster, as I was asked to come to their studio to…
Folks, My recent post on tin whiskers sparked the memory of tin pest in my mind. I have to admit, that with all of the legitimate reliability concerns related to tin whiskers, I am surprised that there has been essentially no parallel concern for the risks of tin pest. Admittedly, tin pest…
Let’s quickly review the advantages of Bi/Sn/Ag alloy tabbing ribbon coating before we discuss them further: Low temperature melting point Pb-free, by definition Beneficial mechanical properties The particular bismuth-based solder alloy that is most commonly used for…
From One Engineer to Another®
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