circuit board

Seth Homer

Seth Homer

Product Manager Engineered Solders

Indium Corporation
Phone: +1 (315) 853-4900
E-mail: shomer@indium.com
Address: 34 Robinson Rd., Clinton, NY USA 13323

Blog

Seth Homer's Blog

Biography

Watch Seth's From One Engineer to Another Video

Seth is a Product Manager for Indium Corporation’s Engineered Solder Materials. He has worked with Indium Corporation for over 20 years, serving in both manufacturing operations and marketing roles. While in operations, Seth was responsible for many of the products within the engineered solders product offering. In 2006, he transitioned to a marketing role as a liaison between customer support teams, globally. Over the years, Seth has been responsible for:

  • Thermal Interface Materials
  • Au and Au-containing alloys
  • Flux-coated preforms
  • Solder ribbon  and wire
  • NanoFoil®
  • InFORMS®

Seth has also provided marketing support for specific industries, such as RF infrastructure and was heavily involved in the development of Indium’s LV1000 flux coating, which was designed specifically for that industry.

Currently, Seth is working with the IGBT and power electronics industries, gaining insight by travelling to customer sites globally and working closely with manufacturing internally as he helps support current production demand and future product development. 

Seth Homer's Blog Posts

Solder Redefined Part 4 – Baseplate to Heat-Sink

07 Jun 2017 by Seth Homer [view bio]

At Indium Corporation, we're redefining how we use solder at the die-attach, DBC to baseplate, and baseplate to heat-sink levels so we can achieve a more reliable IGBT that can perform at increasingly higher standards. If you missed the first three videos in this series, get caught up at indium.com/IGBT.

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Solder Redefined Part 3 – DBC Substrate to Baseplate

06 Jun 2017 by Seth Homer [view bio]

As we've discussed, there are three attach levels of peak concern in the IGBT stack up. At Indium Corporation, we're redefining how we use solder at the die-attach, substrate, and baseplate to heat-sink levels, so we can achieve a more reliable IGBT that can perform increasingly higher standards. If you missed the first two videos in this series, be sure to check them out at www.indium.com/IGBT.

Read More

Solder Redefined Part 2 – Die-Attach

05 Jun 2017 by Seth Homer [view bio]

As discussed in video one of this four video series, there are three attach levels of peak concern in the IGBT stack up. By redefining how we use solder at the die-attach, DBC Substrate, and Baseplate level, we can achieve a more reliable IGBT that can form at increasingly higher standards. If you missed that video, be sure to check it out at www.indium.com/IGBT.

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