Seth Homer

Assistant Product Manager
Indium Corporation
Phone: +1.315.853.4900
E-mail: shomer@indium.com
Address: 34 Robinson Rd., Clinton, NY USA 13323
Blog
Biography
Seth is the Assistant Product Manager for Indium Corporation’s Engineered Solders, Thermal Materials, and NanoFoil® preforms. He acts as a technical liaison between customers and internal departments such as R&D and production, to ensure the best quality and selection of products.
Seth has been with Indium Corporation for 20 years, serving as manufacturing supervisor for various engineered electronics assembly materials, including: solder spheres, sputtering targets, indium compounds, and solder preforms. Seth has also worked extensively with our Customer Support team, especially those in China, Singapore, and Europe.
Seth is an IPC-A610D certified specialist, and is currently pursuing a degree in business from Mohawk Valley Community College in Utica, N.Y., where he has also taken courses in mechanical engineering.
Seth lives in Deansboro, N.Y., and enjoys spending time with his six children, and remodeling his 150-year-old house.
Seth Homer's Technical Documents
Seth Homer's Blog Posts
The Magic of Engineered Solders
Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless. One of my personal favorite engineered solders is Solder Fortification® Preforms.…
Void Reduction in Solder Joints
It is often said that a chain is only as strong as it weakest link, the same can be true for a series of solder joints on a component. When one is bad, the rest are useless. Quite often, voiding is the failure mechanism.In many cases voiding can be traced back to residual flux left in the joint. Optimizing…
Practical Suggestions for Solder Preform Design and Implementation
Have you ever found yourself knowing where you want to go, but not sure how to get there? This can be frustrating and time consuming if not impossible without a map. It can be the same when introducing a solder preform into your process. You know what you hope to achieve by adding a preform, but where…
From One Engineer to Another®
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