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Seth Homer

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Seth Homer

Assistant Product Manager

Indium Corporation
Phone: +1.315.853.4900
E-mail: shomer@indium.com
Address: 34 Robinson Rd., Clinton, NY USA 13323

Blog

Seth Homer's Blog

Biography

Watch Seth's From One Engineer to Another Video

Seth is the Assistant Product Manager for Indium Corporation’s Engineered Solders, Thermal Materials, and NanoFoil® preforms. He acts as a technical liaison between customers and internal departments such as R&D and production, to ensure the best quality and selection of products.

Seth has been with Indium Corporation for 20 years, serving as manufacturing supervisor for various engineered electronics assembly materials, including: solder spheres, sputtering targets, indium compounds, and solder preforms. Seth has also worked extensively with our Customer Support team, especially those in China, Singapore, and Europe.

Seth is an IPC-A610D certified specialist, and is currently pursuing a degree in business from Mohawk Valley Community College in Utica, N.Y., where he has also taken courses in mechanical engineering.

Seth lives in Deansboro, N.Y., and enjoys spending time with his six children, and remodeling his 150-year-old house.

Seth Homer's Technical Documents

Request This Document

Evaluation of Test Protocol for Eutectic Die-Attach Using High Power LEDs

Authors: Amanda Hartnett, Daniel Evans Jr., Don Beck, Seth Homer

Posted on 14 Oct 2011

Request This Document

Minimizing Voiding in QFN Packages Using Solder Preforms

Authors: Dr. Ronald C. Lasky, Seth Homer

Posted on 14 Oct 2011

Seth Homer's Blog Posts

The Magic of Engineered Solders

Friday, April 05, 2013

Engineered solders are solders that can make a HUGE difference with your thermal management, IGBT, die-attach, medical device, hermetic sealing, or connector assembly application. The possibilities are endless. One of my personal favorite engineered solders is Solder Fortification® Preforms.…

Read more

Void Reduction in Solder Joints

Friday, January 13, 2012

It is often said that a chain is only as strong as it weakest link, the same can be true for a series of solder joints on a component. When one is bad, the rest are useless. Quite often, voiding is the failure mechanism.In many cases voiding can be traced back to residual flux left in the joint. Optimizing…

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Practical Suggestions for Solder Preform Design and Implementation

Friday, January 13, 2012

Have you ever found yourself knowing where you want to go, but not sure how to get there? This can be frustrating and time consuming if not impossible without a map. It can be the same when introducing a solder preform into your process. You know what you hope to achieve by adding a preform, but where…

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From One Engineer to Another®

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