Tim Jensen
Product Manger, PCB Assembly Materials
Indium Corporation
Phone: +1.315.853.4900 x756
E-mail: tjensen@indium.com
Address: 34 Robinson Rd., Clinton, NY USA 13323
Blog
Biography
Tim Jensen is the product manager for Indium Corporation's PCB Assembly Materials, and is a Surface Mount Technology Association (SMTA)-certified SMT process engineer. His product lines include:
- Tin-lead and lead-free solder pastes
- Halogen-free soldering materials
- Wave solder fluxes
- Bar solder
- Rework fluxes
- Flux-cored wire
- Package-on-Package (PoP) solder pastes and fluxes
Tim has spent over 15 years working with customers to troubleshoot and optimize SMT process lines, and solving issues such as:
- Head-in-pillow
- Graping
- QFN voiding
Having worked directly on hundreds of surface mount lines, and developing thousands of different products, Tim understands each customer's unique requirements. Using that direct knowledge and expertise, he works closely with Indium's technical service, sales, and research and development teams to develop cutting edge products that address the unique challenges faced by the electronics assembly industry.
Tim readily shares his expertise by authoring technical papers, writing for technical publications, and is an active member of several IPC standards development committees. He has presented at technical conferences nationally and internationally. Some of his works include:
- Head-in-Pillow: The Defect that Caught Us Napping
- The Graping Phenomenon: Improving Pb-free Coalescence through Process and Material Optimization
- Influence of reflow Profiling and Pb-free Solder Paste in Minimizing QFN Voiding
- Stencil Printing and Reflow in Pb-free Assembly
- Challenges of Implementing a Halogen-free PCB Assembly Process
- Proliferation of Lead-free Alloys
Tim has a bachelor's degree in chemical engineering from Clarkson University, and is a member of the SMTA. Tim also authors a blog, which can be found at http://blogs.indium.com/blog/tim-jensen.
Tim Jensen's Technical Documents
Tim Jensen's Blog Posts
Thermal Cycling Performance of SACM™ Pb-Free Solder Alloy
The development of SACM™ lead-free solder alloy by Indium Corporation’s R&D team was focused around improving the mechanical shock performance of low-Ag SAC (SnAgCu) alloys. We learned that the addition of Mn to create SACM™ also helps to improve the thermal cycling performance…
Metal Cost Drives Solder Alloy Decisions
Because of the volatility of the metals market, the price of traditional SAC solders has been somewhat unpredictable. The chart below plots the price of SAC305 metal from June 2009 to June 2012. Traditionally, solder is selected based on whether it meets the temperature and reliability requirements. …
Southeast Asia Technical Conference on Electronics Assembly Presentation
I invite you to come to the Southeast Asia Technical Conference on Electronics Assembly in Penang, Malaysia where I will be giving a workshop on SACM™ . My presentation examines the reliability of low-Ag SAC alloys doped with Mn (SACM) under JEDEC drop, dynamic bending, thermal cycling, and…
From One Engineer to Another®
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