circuit board

Tim Jensen

Tim Jensen

Product Manager for Engineered Solder Materials

Indium Corporation
Phone: +1 (315) 853-4900 x7568
E-mail: tjensen@indium.com
Address: 34 Robinson Rd., Clinton, NY USA 13323

Blog

Tim Jensen's Blog

Biography

Watch Tim Jensen's Reliability Video

Tim Jensen is the Senior Product Manager for Indium Corporation’s Engineered Solder Materials, the company’s most diverse product group. His product group encompasses solder preforms, wire, ribbon, foil, and thermal interface materials. He is responsible for ensuring the product line is poised for long-term success by developing technologies that best meet the current and future needs of customers.

Tim joined Indium Corporation in 1997 and has held a number of positions, including Senior Technical Support Engineer, Pb-Free Programs Manager, and Global Product Manager for PCB Assembly Materials.

Tim has worked directly on hundreds of surface mount lines, and helped customers develop processes and implement new product technologies. Using that direct knowledge and expertise, he worked closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. Tim has authored numerous technical papers on soldering and thermal technology, including:

  • Head-In-Pillow: The Defect That Caught Us Napping
  • The Graping Phenomenon: Improving Pb-free Coalescence through Process and Material Optimization
  • Metallic Thermal Interface Material Testing & Selection for IC, Power, and RF Semiconductors
  • Advances in Solder Preform Technology to Reduce QFN Voiding
  • Challenges of Implementing a Halogen-free PCB Assembly Process
  • Reinforced Solder Technology for Increased Reliability


He also authors a blog, which can be found at http://blogs.indium.com/blog/tim-jensen.

In addition to his responsibilities at Indium Corporation, Tim also serves on the SMTA’s Board of Directors. In this role, he is part of the Strategic Development Committee where he leads the effort on international expansion.

Tim has a bachelor’s degree in chemical engineering from Clarkson University and a master’s degree from Syracuse University. He lives in Utica, N.Y. with his wife, Kelly, and three children, Alex, Reid, and Emmie.

Watch Tim's Bio Video

Tim Jensen's Technical Documents

Tim Jensen's Blog Posts

What Makes a Good Thermal Interface Material?

25 Jul 2018 by Tim Jensen [view bio]

There are many considerations that can figure into your thermal interface material selection.

Read More

Reducing Voiding in Bottom-Terminated Components Using Solder Fortification® Preforms

18 Mar 2016 by Tim Jensen [view bio]

Watch as I discuss the challenge of voiding in bottom-terminated components - and how to Avoid the Void®.

Read More

Avoid the Void® Using Heat-Spring Metal Thermal Interface Materials

18 Mar 2016 by Tim Jensen [view bio]

Watch as I discuss voiding in thermal management and how you can Avoid the Void®.

Read More

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