Senior Product Manager,
Phone: +1.315.853.4900 x756
Address: 34 Robinson Rd., Clinton, NY USA 13323
Tim Jensen is the product manager for Indium Corporation’s Engineered Solder Materials, the company’s most diverse product group. His product group encompasses solder preforms, wire, ribbon, and foil, and thermal interface materials, including gold-tin and tin-lead solder preforms, Solder Fortification® preforms, Heat-Spring® thermal interface materials, and indium-containing preforms. He is responsible for ensuring the product line best meets the needs of the customers.
Tim joined Indium Corporation in 1997 and has held a number of positions, including senior technical support engineer, Pb-free programs manager, and, most recently, global product manager for PCB assembly materials.
Tim has worked directly on hundreds of surface mount lines, and developed thousands of different products. Using that direct knowledge and expertise he worked closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting edge products that address the unique challenges faced by the electronics assembly industry. Tim has authored numerous technical papers on solders and soldering technology, including:
- Head-In-Pillow: The Defect That Caught Us Napping
- The Graping Phenomenon: Improving Pb-free Coalescence through Process and Material Optimization
- Influence of Reflow Profiling and Pb-free Solder Paste in Minimizing QFN Voiding
- Stencil Printing and Reflow in Pb-free Assembly
- Challenges of Implementing a Halogen-free PCB Assembly Process
- Proliferation of Pb-free Alloys
He also authors a blog, which can be found at http://blogs.indium.com/blog/tim-jensen.
Tim has a bachelor’s degree in chemical engineering from Clarkson University and is currently pursuing his MBA at Syracuse University. He lives in New Hartford, N.Y.