Senior Product Manager,
Phone: +1.315.853.4900 x7568
Address: 34 Robinson Rd., Clinton, NY USA 13323
Tim Jensen is the product manager for Indium Corporation’s Engineered Solder Materials, the company’s most diverse product group. His product group encompasses solder preforms, wire, ribbon, and foil, and thermal interface materials, including gold-tin and tin-lead solder preforms, Solder Fortification® preforms, Heat-Spring® thermal interface materials, and indium-containing preforms. He is responsible for ensuring the product line best meets the needs of the customers.
Tim joined Indium Corporation in 1997 and has held a number of positions, including senior technical support engineer, Pb-free programs manager, and, most recently, global product manager for PCB assembly materials.
Tim has worked directly on hundreds of surface mount lines, and developed thousands of different products. Using that direct knowledge and expertise he worked closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting edge products that address the unique challenges faced by the electronics assembly industry. Tim has authored numerous technical papers on solders and soldering technology, including:
- Head-In-Pillow: The Defect That Caught Us Napping
- The Graping Phenomenon: Improving Pb-free Coalescence through Process and Material Optimization
- Influence of Reflow Profiling and Pb-free Solder Paste in Minimizing QFN Voiding
- Stencil Printing and Reflow in Pb-free Assembly
- Challenges of Implementing a Halogen-free PCB Assembly Process
- Proliferation of Pb-free Alloys
He also authors a blog, which can be found at http://blogs.indium.com/blog/tim-jensen.
Tim has a bachelor’s degree in chemical engineering from Clarkson University and is currently pursuing his MBA at Syracuse University. He lives in New Hartford, N.Y.
Tim Jensen's Technical Documents
Tim Jensen's Blog Posts
As we discussed in part I of this three-part series, uneven solder bondline thickness between the substrate and baseplate of an IGBT module can cause stress at the thinner sections1, leading to delamination and premature failure during the operational life of the module. Uniform bondline thickness prevents this stress,...
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electronics Power and Hybrid. They’ve done some exciting work using InFORM® technology to make more reliable solder joints at a lower...
I am happy to announce that Indium Corporation will participate in the Power and High Temperature Electronics Manufacturing Experience at SMTAI. This event is coordinated by my good...