Senior Product Manager, Engineered Solders
Phone: +1.315.853.4900 x756
Address: 34 Robinson Rd., Clinton, NY USA 13323
Tim Jensen is the product manager for Indium Corporation’s Engineered Solder Materials, the company’s most diverse product group. His product group encompasses solder preforms, wire, ribbon, and foil, and thermal interface materials, including gold-tin and tin-lead solder preforms, Solder Fortification® preforms, Heat-Spring® thermal interface materials, and indium-containing preforms. He is responsible for ensuring the product line best meets the needs of the customers.
Tim joined Indium Corporation in 1997 and has held a number of positions, including senior technical support engineer, Pb-free programs manager, and, most recently, global product manager for PCB assembly materials.
Tim has worked directly on hundreds of surface mount lines, and developed thousands of different products. Using that direct knowledge and expertise he worked closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting edge products that address the unique challenges faced by the electronics assembly industry. Tim has authored numerous technical papers on solders and soldering technology, including:
- Head-In-Pillow: The Defect That Caught Us Napping
- The Graping Phenomenon: Improving Pb-free Coalescence through Process and Material Optimization
- Influence of Reflow Profiling and Pb-free Solder Paste in Minimizing QFN Voiding
- Stencil Printing and Reflow in Pb-free Assembly
- Challenges of Implementing a Halogen-free PCB Assembly Process
- Proliferation of Pb-free Alloys
He also authors a blog, which can be found at http://blogs.indium.com/blog/tim-jensen.
Tim has a bachelor’s degree in chemical engineering from Clarkson University and is currently pursuing his MBA at Syracuse University. He lives in New Hartford, N.Y.
Tim Jensen's Technical Documents
Tim Jensen's Blog Posts
Register for my Professional Development Course at APEX
On Monday, March 24, I will be giving a professional development course at the IPC APEX Expo in Las Vegas, Nevada. The course, Understanding and Solving Head-In-Pillow, Non-Wet Open, and QFN/CSP Voiding Challenges, will cover many of the factors that contribute to the three most challenging…
SMTAi Tutorial: Soldering Technology for SMT: Achieving High Yields and Reliability
On Monday, October 14th I will be presenting a tutorial at the SMTA International Conference in Fort Worth, Texas. The tutorial, Soldering Technology for SMT: Achieving High Yields and Reliability, offers a detailed discussion of soldering materials, components, and PCBs to help you gain an understanding…
Thermal Cycling Performance of SACM™ Pb-Free Solder Alloy
The development of SACM™ lead-free solder alloy by Indium Corporation’s R&D team was focused around improving the mechanical shock performance of low-Ag SAC (SnAgCu) alloys. We learned that the addition of Mn to create SACM™ also helps to improve the thermal cycling performance…
From One Engineer to Another®
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