Avoid the Void® Using Heat-Spring Metal Thermal Interface Materials
Watch as I discuss voiding in thermal management and how you can Avoid the Void®....
Tim Jensen
Reducing Voiding in Bottom-Terminated Components Using Solder Fortification® Preforms
Watch as I discuss the challenge of voiding in bottom-terminated components - and how to Avoid the Void®....
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBT Assembly: Part II
As we discussed in part I of this three-part series, uneven solder bondline thickness between the substrate and baseplate of an IGBT module can cause ...
Achieving Uniform Solder Bondline Control Between Substrate and Baseplate in IGBTs: Part I
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electroni...
Power and High Temperature Electronics Manufacturing Experience at SMTAI
I am happy to announce that Indium Corporation will participate in the Power and...
Register for my Professional Development Course at APEX
On Monday, March 24, I will be giving a professional development course at the IPC APEX Expo in Las Vegas, Nevada. The course, Understanding and ...
SMTAi Tutorial: Soldering Technology for SMT: Achieving High Yields and Reliability
On Monday, October 14th I will be presenting a tutorial at the SMTA International Conference in Fort Worth, Texas. The tutorial, Soldering Technology ...
Thermal Cycling Performance of SACm® Pb-Free Solder Alloy
The development of SACm® lead-free solder alloy by Indium Corporation’s R&D team was focused around improving the mechanical shock perfo...
Metal Cost Drives Solder Alloy Decisions
Because of the volatility of the metals market, the price of traditional SAC solders has been somewhat unpredictable. The chart below plots the price ...
Southeast Asia Technical Conference on Electronics Assembly Presentation
I invite you to come to the Southeast Asia Technical Conference on Electronics Assembly in Penang, Malaysia where I will be giving a workshop on SACm&...
Drop Test Performance of SACm® Pb-Free Solder Alloy
As I discussed in my last post, the industry has found that reducing the silver content of SAC alloys helps to improve its mechanical shock performanc...
Why the World Needs SACm® Solder: improved shock resistance and thermal cycling performance in electronics assembly
As the world began transitioning to Pb-Free solder in the early 2000’s, the electronics industry determined that SAC387 (95.5Sn/3.8Ag/0.7Cu) was...