Reducing Voiding in Bottom-Terminated Components Using Solder Fortification® Preforms
Watch as I discuss the challenge of voiding in bottom-terminated components - and how to Avoid the Void®....
Watch as I discuss the challenge of voiding in bottom-terminated components - and how to Avoid the Void®....
Watch as I discuss voiding in thermal management and how you can Avoid the Void®....
As we discussed in part I of this three-part series, uneven solder bondline thickness between the substrate and baseplate of an IGBT module can cause ...
The next few posts come to us from my colleagues Karthik Vijay, Indium Corporation’s Technical Manager for Europe and Liam Mills of TT Electroni...
I am happy to announce that Indium Corporation will participate in the Power and...
On Monday, March 24, I will be giving a professional development course at the IPC APEX Expo in Las Vegas, Nevada. The course, Understanding and ...
On Monday, October 14th I will be presenting a tutorial at the SMTA International Conference in Fort Worth, Texas. The tutorial, Soldering Technology ...
The development of SACm® lead-free solder alloy by Indium Corporation’s R&D team was focused around improving the mechanical shock perfo...
Because of the volatility of the metals market, the price of traditional SAC solders has been somewhat unpredictable. The chart below plots the price ...
I invite you to come to the Southeast Asia Technical Conference on Electronics Assembly in Penang, Malaysia where I will be giving a workshop on SACm&...
As I discussed in my last post, the industry has found that reducing the silver content of SAC alloys helps to improve its mechanical shock performanc...
As the world began transitioning to Pb-Free solder in the early 2000’s, the electronics industry determined that SAC387 (95.5Sn/3.8Ag/0.7Cu) was...