I invite you to come to the Southeast Asia Technical Conference on Electronics Assembly in Penang, Malaysia where I will be giving a workshop on SACm®.
My presentation examines the reliability of low-Ag SAC alloys doped with Mn (SACm®) under JEDEC drop, dynamic bending, thermal cycling, and cyclic bending test conditions and compared to eutectic SnPb, SAC105, and SAC305 alloys.
For more information, or to register, visit http://www.smta.org/education/symposia/symposia.cfm#penang.
Tim