The development of SACm® lead-free solder alloy by Indium Corporation’s R&D team was focused around improving the mechanical shock performance of low-Ag SAC (SnAgCu) alloys. We learned that the addition of Mn to create SACm® also helps to improve the thermal cycling performance through refining the grain structure and slowing the intermetallic growth during aging.
The thermal cycling performance of SACm® is superior to SAC305 after aging (see graph).
To learn all of the performance attributes of SACm®, visit www.indium.com/SACm.
*This post is part of the Introducing SACm® series.