Amanda's presentation, Metallic TIMs for High-Brightness LED Packaging, will include a discussion of metallic TIMs and solders, including packaging techniques required for use and the expected performance derived from independent thermal materials testing, as well as in-situ testing completed on functional LED boards.
Amanda provides advice on thermal design issues in many different industries, including communications, military, and photonics. Amanda specializes in coaching manufacturing, process, and design engineers on their choice and application of solder interface materials and other bonding materials to achieve reliable and high-performance thermal attachment solutions.
Amanda has presented at industry technical seminars and authored technical papers on thermal management and microelectronics packaging materials. She is active in several industry organizations including SPIE, IMAPS, and the IPC.
Prior to establishing her career with Indium Corporation, Amanda received her bachelor's degree in Chemistry from Utica College and worked as a research lab technician at Cornell University, focusing on the physical properties of silicon. She is a member of the American Chemical Society. Amanda is based at Indium Corporation's global headquarters in Clinton, NY and resides in Utica, NY. She also authors a technology blog, which can be found at http://blogs.indium.com/blog/amanda-hartnett.
For more information on the IMAPS Mid-Atlantic Microelectronics Conference, visit http://www.imaps.org/programs.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.