Indium Corporation will feature Heat-Spring®, a compressible, recyclable, metal thermal interface material, at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.

The use of high-power LEDs is growing exponentially due to light quality, energy efficiency, and reliability. These attributes are directly related to design and assembly methods and materials.

Indium Corporation’s Heat-Spring is a compressible interface material that provides 86 W/mK of thermal conductivity using a pressure range of only 35 to 100+ psi. Heat-Spring is suitable for pick-and-place equipment, and offers superior conductivity and ease of use, as compared to thermal grease alternatives. In addition, Heat-Spring will not bake out or pump out, optimizing long-term performance consistency and eliminating the rework process.

Heat-Spring is reclaimable and recyclable, and is packaged in custom trays or tape & reel.

For more information on Heat-Spring, visit www.indium.com/thermal-interface-materials/heat-spring.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
 

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.