Many applications call for TIM that can easily be placed on a chip, on a lid or perhaps just against a heat source and a cooling solution contact plate. We developed a metal TIM which would work as a compressible Interface Solution for such an application. Our pressure range is 35psi to 100+ psi.
BLT Thermal Resistance
Gap Thermal Resistance
Bulk Thermal Resistance
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An SMA-TIM made of indium offers uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of indium minimizes surface resistance and increases heat flow. Our patented Heat-Spring® technology will further reduce the thermal resistance.
Indium's line of high-end thermal interface materials delivers superior performance over time. As SMA-TIM products are made of metal, they cannot experience pump out problems even under power cycling. The Heat-Spring® material, which does not contain silicone, will conform to surface disparities over time, thereby reducing thermal resistance through the life of the TIM. Due to its solid state, the SMA-TIM also resists bake out.
Heat-Spring® Technical Documents
Product Data Sheets
Safety Data Sheets
Heat-Spring® Blog Posts
Senior Product Manager, Engineered Solders
From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.