Many applications call for a TIM (thermal interface material) that can easily be placed on a chip, on a lid, or, perhaps, just against a heat source and a cooling solution contact plate. We developed a metal TIM which works as a compressible Interface Solution for such an application. Our pressure range is 35 psi to 100+ psi.
BLT Thermal Resistance
Gap Thermal Resistance
Bulk Thermal Resistance
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An SMA-TIM (soft metal alloy) made of indium offers uniform thermal resistance at lower applied stresses in compressed interfaces. The malleability of indium minimizes surface resistance and increases heat flow (conductance). Our patented Heat-Spring®® technology further reduces the thermal resistance and enhances cooling.
Indium's high-end thermal interface materials deliver superior performance over time. Because SMA-TIM products are made of metal, they cannot experience pump out problems - even under power cycling. Our Heat-Spring®® material, which does not contain silicone, conforms to surface disparities, reducing thermal resistance through the life of the TIM. Due to its solid state, the SMA-TIM also does not bake out.
Related Markets and Applications
Top Heat-Spring® Technical Documents
Indium Thermal Interface Materials (TIM) (US Letter)
Indium Thermal Interface Materials (TIM) (A4)
5RMA and 5RA Liquid Fluxes for Solder Thermal Interface Applications (sTIM) (US Letter)
Product Data Sheet
5RMA and 5RA Liquid Fluxes for Solder Thermal Interface Applications (sTIM) (A4)
Product Data Sheet
Use of Heat-Spring® Material (US Letter)
Heat-Spring® Technical Documents
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Safety Data Sheets
Heat-Spring® Blog Posts
High performance thermal management requires high performance materials. In this case, Heat-Spring®
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From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.