Several Indium Corporation technology experts will share their technical expertise at APEX in San Diego, California, February 28-March 1, 2012.
Ning-Cheng Lee, PhD, Vice President of Technology
- High Melting Lead-Free Mixed BiAgX Solder Paste System
This paper discusses a Pb-free approach to forming high temperature (>260°C) solder joints using a mixed-powder solder paste system.
- Drop Test Performance of BGA Assembly using SAC105Ti Solder Spheres
SAC105Ti provides enhanced drop shock resistance for BGAs. This paper presents how performance can be further improved with process considerations.
Ronald C. Lasky, PhD, PE, Senior Technologist
- Minimizing Voiding in QFN Packages Using Solder Preforms
This paper explains the preform requirements and process adjustments needed to use preforms in a standard SMT process. In addition, experimental data is included which shows that the use of preforms can reduce voiding.
- Correlation of SIR, Halide/Halogen, and Copper Mirror Tests
There are several theories behind the various test techniques for halides and halogens. This paper presents their differences, and how the presence of halides in the flux activators will affect the SIR and copper mirror results.
Eric Bastow, Assistant Technical Manager
- No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
Learn how flux residue and underfill interact when they come into contact on a PCB or under an RF shield, and how this interaction can affect long-term electrical integrity.
Brook Sandy, Product Support Specialist, PCB Assembly Materials
- Choosing a Low Cost Alternative to SAC Alloys for PCB Assembly
This paper compares established and emerging choices for alternative Pb-free alloys. It will show that high Ag-containing Pb-free alloys may not be the best choice for all applications.
Brandon Judd, Technical Support Engineer
- The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
Decreased powder size and increased oxide content of the powder in package-on-package solder pastes affects the voiding performance of the materials. This paper answers the question, to what degree?
Indium Corporation's Senior Technical Support Engineer Mario Scalzo will serve as session chair for this session.
In addition, Dr. Lasky will lead the professional development course, Lead-Free Assembly for High Yields and Reliability.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests cover advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is also a member of the SMTAI planning committee.
Dr. Lasky, holder of the prestigious SMTA Founder's Award, is a world-renown process expert and an Instructional Professor at Dartmouth College. He has over 25 years of experience in electronics and optoelectronic packaging and assembly. He has authored or edited five books and numerous technical papers and holds several patent disclosures. Dr. Lasky also authors a technology blog which can be found at www.indium.com/drlasky.
Eric Bastow joined Indium Corporation in 2001 starting as a laboratory technician under the direction of Dr. Ning-Cheng Lee and then in the field of technical support, including serving as a Senior Technical Support Engineer. He is an SMTA-certified process engineer (CSMTPE) and is certified as a Six Sigma Green Belt from Dartmouth College's Thayer School of Engineering. He is also a certified IPC-A-600 and 610D Specialist. Eric has an associate's degree in Engineering Science from Herkimer County Community College and has authored several technical papers and articles.
Brook Sandy acts as a technical liaison between our customers and internal departments, such as R&D and production, to assure the best quality and selection of products. She also provides support in improving informational materials to assist PCB assembly materials customers. Brook attended the University of Rhode Island in the International Engineering Program, and earned degrees in Chemical Engineering (with a focus on materials) and German Language. She also authors a blog, http://blogs.indium.com/blog/brooksandy.
Brandon Judd is a Technical Support Engineer supporting Indium Corporation's advanced SMT materials, including solder pastes, thermal interface materials, and engineered solders. He specializes in the optimization of SMT lines, such as stencil printing parameters and reflow profiling. Brandon earned a bachelor's degree in Mechanical Engineering Technology from the State University of New York Institute of Technology. He is an SMTA-certified process engineer (CSMTPE) and has earned his Lean Six Sigma Green Belt from the Thayer School of Engineering at Dartmouth College. He is also a certified IPC-A-600 and 610D Specialist.
Mario Scalzo joined Indium Corporation in 2000. He holds a bachelor's degree in Chemistry from Saint Anselm College and a certificate from the American Chemical Society for Professional Education. He is an SMTA-Certified Process Engineer and has a Six-Sigma Black Belt from Dartmouth College's Thayer School of Engineering. He is also the author of the Electronics Assembly Materials blog, http://www.indium.com/blogs/Mario-Scalzo-Blog/.
Indium Corporation will be exhibiting at booth 3415.
For more information about APEX and the technical conferences, visit www.goipcshows.org.
To download copies of these papers after APEX, visit www.indium.com/techlibrary/whitepapers.
Indium Corporation is a premier materials supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputter targets; indium, gallium, and germanium chemicals and sourcing; and Reactive NanoFoil®. Founded in 1934, Indium Corporation has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.