Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will give several presentations at the 63rd Electronic Components and Technology Conference (ECTC) May 28-31 in Las Vegas, NV.
- Professional Development Course: Lead-Free Solder Joint Reliability – Material Consideration. This course will cover materials considerations required for achieving high-reliability lead-free solder joints. The emphasis of this course is placed on the understanding of how the various factors contribute to the failure modes, and how to select proper solder alloys and surface finishes for achieving high-reliability.
- Presentation: Effective Voiding Control of QFN via Solder Mask Patterning. Dr. Lee will discuss common causes of QFN voiding, including venting accessibility, hidden vias, and insufficient solder, and how to prevent this defect.
- Presentation: Voiding Mechanism and Control in BGA Joints with Mixed Solder Alloy System. Dr. Lee will present data collected while observing the voiding behavior of mixed solder alloy systems under a variety of conditions.
Dr. Lee has extensive experience in the development of solder pastes, fluxes, high-temperature polymers, microelectronics encapsulants, underfills, and adhesives for electronics assembly. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with emphasis on both high-performance and low-cost of ownership. Dr. Lee is an SMTA Member of Distinction and a member of the SMTAI planning committee.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.