Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, will give two presentations and teach a professional development course at the International Conference on Electronic Packaging Technology (ICEPT), August 11-14, in Dalian, China.

  • Low Cost High Reliability Assembly of Thermally Warped PoP with Novel Epoxy Flux on Solder Paste – In this presentation, Dr. Lee discusses a newly developed epoxy flux, compatible with solder paste, to address the drop failure of area array packages, such as BGAs, CSPs, and PoP.
  • Shock Resistant and Thermally Reliable Low-Ag SAC Solder Doped with Mn – This presentation discusses a new soldering alloy doped with Mn, and its considerable improvement in shock resistance and thermal fatigue performance.
  • Electromigration – The Hurdle for Miniaturization and High Power Devices – This professional development course covers all critical aspects of electromigration of solder joints, including failure mechanism, effect of solder alloy composition, solder joint metallurgy and configuration, pad design, pad composition, current density, temperature, and current polarity. Additionally, this course reviews and discusses electromigration behavior within the redistribution layer.

Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advanced materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.

ICEPT is a four-day event featuring technical sessions, invited talks, professional development courses/forums, exhibition, and social networking activities. It covers the latest technological developments in electronic packaging, manufacturing, and packaging equipment, and provides opportunities to explore the trends of research and development, as well as business in China.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com.