On March 4, Dr. Lee will present Lead-free Solder Alloys – Pros and Cons and Novel High Temperature Option BiAgX at SMTA Dallas in Plano, Texas. This presentation covers the pros and cons of lead-free soldering, including process and reliability. Dr. Lee will also discuss a novel high temperature lead-free solder system called BiAgX®.
On March 6, Dr. Lee will present Voiding Control and Reliability of Solder Joints with Backward Compatibility at SMTA Houston in Stafford, Texas. His presentation discusses the voiding performance of backward compatible systems in terms of reflow profiles, alloy combinations, and reliability when compared to tin-lead and lead-free systems.
For more information about these two presentations or the SMTA expos, visit www.smta.org/expos.
Dr. Lee is a world-renown soldering expert and an SMTA Member of Distinction. He has extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. His current research interests include advance materials for interconnects and packaging for electronics and optoelectronics applications, with an emphasis on both high performance and low cost of ownership.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.