Durham's paper, Semiconductor Fluxes for Wafer Bumping in 3D Assembly, was presented at the IMAPS Conference on Device Packaging. The paper explores the spin-coating process for bump fusion fluxes, which is an important processing technique, used in the electronics assembly industry. This approach uses centrifugal force to produce a uniform thickness of fluid material on a rotation surface to coat silicon wafers.
Indium Corporation's Silver Quill Award encourages individuals to author technical reports, presentations, articles, and books. It then honors the most effective works based on their relevance and impact on the industry.
The paper may be downloaded at www.indium.us/E039.
Durham serves as a technical liaison between Indium Corporation's customers and internal departments, such as sales, technical support, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor's degree in physics and applied mathematics from Clarkson University in Potsdam, N.Y.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.