Technical Support Engineer, Semiconductor and Advanced Assembly Materials
Phone: +1 (315) 853-4900 x2037
Address: 34 Robinson Rd., Clinton, NY USA 13323
Maria Durham is a Technical Support Engineer for Indium Corporation’s Semiconductor and Advanced Assembly Materials group. Her areas of expertise include wafer bumping fluxes and package-on-package (PoP) assembly, as well as mathematical and engineering modeling.
Maria serves as a technical liaison between Indium Corporation’s customers and internal departments, such as sales, technical support, R&D, and operations. She also performs experiments, gathers data, and writes papers in association with our international R&D and Technical groups. In addition, she is a key interface between Indium Corporation and equipment partners in the Semiconductor and Advanced Assembly Materials markets.
Before joining Indium Corporation, Maria was a Process Engineer for the screen printing and dicing processes for the multi-layer capacitor production at Dielectric Laboratories. She also worked for several contracting companies as part of the Air Force Research Laboratory in Rome, NY.
Maria earned her bachelor’s degree in Physics and Applied Mathematics from Clarkson University. While at Clarkson she worked as a McNair Scholar where she performed research in electro-chemical deposition.
Maria Durham's Blog Posts
The 48th International Symposium on Microelectronics was held in Orlando, FL last month on October 26th through the 26th, 2015. I was able to attend as both as an exhibitor and as a session co-chair. Indium Corporation showcased several materials for thermal, power and automotive electronics which...
The 47th International Symposium on Microelectronics will be held in San Diego, CA, on October13th through the 16th, 2014. Here’s the IMAPS 2014 program. The Indium Corporation will be...
The ball-attach process can be considered a trivial step when creating an FCBGA or similar package, but the final soldering step can be rather complex. There are several variables that impact the final ball-attachment...
From One Engineer to Another®
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