Indium Corporation's Maria Durham, Technical Support Engineer for Semiconductor and Advanced Assembly Materials, will present and co-chair a technical session at the International Microelectronics Assembly and Packaging Society (IMAPS) New England Chapter 2015 Symposium and Expo on May 5 in Boxborough, Mass.
The semiconductor assembly industry continues its movement toward finer-pitch materials and reduced copper pillar height. As a result, cleaning processes are increasingly more difficult. Durham's presentation, Ultra-Low Residue (ULR) Semiconductor-Grade Fluxes for Flip-Chip and MEMs Application, discusses the use of semiconductor-grade, ultra-low residue, no-clean fluxes that help meet this industry challenge. Her presentation also discusses the benefits of using ULR no-clean fluxes.
In addition to her presentation, Durham will also serve as a session co-chair for Advanced Technologies for 2.5D/3D Packaging, which will discuss the impact of high-density 3D packages, other aspects of 2.5D/3D integration technology and applications, and copper pillar and underfill challenges.
Durham serves as a technical liaison between Indium Corporation's customers and internal departments, such as sales, technical support, research and development, and operations to guarantee the best quality and selection of products. She earned her bachelor's degree in physics and applied mathematics from Clarkson University in Potsdam, N.Y.
IMAPS is a global community of microelectronic related engineers, scientists, manufacturers, end-users, and supply chain companies. The Society aims to support the development and growth of the microelectronics and related industries, and to aid the transfer of knowledge and information.
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.
For more information about Indium Corporation, visit www.indium.com or email firstname.lastname@example.org. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.