Several of Indium Corporation’s technical experts will share their expertise at the IPC APEX Expo technical conference on February 27-March 1 in San Diego, Calif.

Vice President of Technology Dr. Ning-Cheng Lee will lead two presentations during sessions on Alloy Reliability I (S15) and Alloy Reliability II (S23):

  • Sn3.2/Ag0.7/Cu5.5/Sb Solder Alloy With High-Reliability Performance Up to 175°C
  • Low-Temperature Solder Alloys With High-Reliability Performance

Additionally, Eric Bastow, Assistant Technical Manager, America’s Region, and Robert McKerrow, Product Specialist – Engineered Solders will present on:

  • The Effect of a Nitrogen Reflow Environment on the Electrical Reliability of Rosin-Based No-Clean Solder Paste Flux Residue, during a session on Surface Insulation Resistance (S10); and
  • Solder Fortification® and Flux-Coated Preforms during the poster presentation sessions on Wednesday, Feb. 28.

For more information on the technical and poster sessions offered at IPC APEX, visit www.ipcapexexpo.org.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.