Indium Corporation’s Dr. Ning-Cheng Lee, Vice President of Technology, has been bestowed the prestigious title of Fellow of the Institute of Electrical & Electronics Engineers (IEEE) for his leadership in surface mount technology and interconnect materials.

IEEE is the world’s largest technical professional association with more than 400,000 members in 160 countries. To be chosen as an IEEE Fellow is a distinction reserved for select IEEE members whose extraordinary accomplishments are deemed fitting of this esteemed designation. Less than 0.1% of voting members are selected annually.

Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT industries, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, visit www.indium.com or email abrown@indium.com. You can also follow our experts, From One Engineer To Another® (#FOETA), at www.facebook.com/indium or @IndiumCorp.