Indium Corporation’s Jacques Matteau, Global Sales Manager – NanoBond® and NanoFoil®, and Jim Hisert, PV Applications Engineer, will present at the Society of Vacuum Coaters (SVC) Technical Conference April 23-24 in Providence, R.I.
Matteau’s presentation, High-Temperature, Pb-free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil, will compare traditional Sn-based solders typically used in physical vapor deposition processes, specifically comparing shear strength, void analysis, and cross-sectional analysis.
Hisert will present: Eliminating the Bond Stress of Sputtering Targets at Operational Temperatures. This paper explores the possibility of setting the “zero stress point” at different temperatures to minimize stress during sputtering target assembly caused by thermal expansion mismatches and deflection during operation.
Matteau is responsible for market development and sales of Indium Corporation’s NanoFoil® products to the target industry, where it is used to NanoBond® targets to the backing plate. His focus is on semiconductor, disk drive, and solar industries throughout Asia, Europe, and the U.S. Matteau has over 20 years of experience with thin-film technologies and the electronics industry.
Hisert is responsible for supporting Indium Corporation’s materials for the photovoltaic industry. He readily shares his expertise by authoring technical papers, presenting at professional seminars, and participating actively in the IPC subcommittee, “Acceptance Criteria for Tabbing and Stringing.”
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, solar, thin-film and thermal management markets. Products include solders, preforms, and fluxes; brazes; sputtering targets; indium, gallium, and germanium metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Singapore, South Korea, the United Kingdom, and the USA.