Wafer Bumping Flux
Solder bumps on wafers may be produced by a variety of processes. For bumps with a pitch greater than 100microns, solder paste is often used to form the bump. Solder bumping of the top surface of BGA and PGA substrates for solder-on-pad (SOP) usually uses a very fine solder paste rather than plating. Formation of the much larger (0.3-0.6mm pitch) solder bumps on waferlevel CSPs is by a ball-drop process.
Related Markets and Applications
Critical Products
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter (Paper)
Technical Paper
Indium Bump Electroplating of Wafers Using Pulse Plating (Letter) (A4)
Application Note
Interconnections for SMT, BGA, and Flip Chip Technologies (Paper)
Technical Paper
Lead-Free Soldering and Low Alpha Solders for Wafer Level Interconnects (Paper)
Technical Paper
Wafer Bumping Flux Technical Documents
Material Safety Data Sheets
Solder Bumping Blog Posts
Ball-Attach Flux WS-446-NRD for Poor Quality OSP-wetting
While on a recent trip to Malaysia, I interviewed two colleagues regarding trends in semiconductor assembly. My previously-published interview with Sze-Pei Lim appears here. This time, while on a visit to a logic device manufacturer in the North West, I [ACM] talked briefly to Sehar Samiappan [SS],…
Solder Paste and Flux Dip Depth: I
My friend and colleague Chris Nash and I were recently discussing some puzzling results for low dip height found during testing of package-on-package (PoP) materials. The findings will be of interest to everyone who uses a dipping process in both SMT and flip-chip assembly. Firstly, a little background.…
Package-on-Package (PoP) Solder Paste
A quick trip to discuss roadmapping with one of the world’s top processor manufacturers, and a visit to discuss Pb-free power die-attach materials, left me with a few hours to spare at LAX.This time around I was trying to work out how much package-on-package (PoP) solder paste we would expect to…
This page is owned by:
Andy C. Mackie, PhD, MSc
Global Product Manager of Semiconductor and Advanced Assembly Materials
amackie@indium.com
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