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Whitepapers

Home » Technical Documents » Whitepapers

Whitepapers
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Newest Whitepapers

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Reinforced Solder Preforms for High-Reliability and Low-Voiding

Authors: Adam Murling, Sunny Neoh, Timothy Jensen

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Metal Thermal Interface Materials in Power Devices

Authors: Bob Jarrett, Jordan Ross

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Applications of Solder Fortification® With Preforms

Authors: Carol Gowans, Dr. Ronald C. Lasky

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Room Temperature LED and D-Pak Type Component-Attach and Reliability Testing

Authors: Indium Corporation

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Down-Selecting Low Solids Fluxes for Pb-free Selective Soldering

Authors: Indium Corporation

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Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue

Authors: Eric Bastow

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Fine Feature Stencil Printing 0.3MM Pitch Components (English)

Authors: Dr. Ronald C. Lasky, Ed Briggs

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Overcoming Assembly Challenges with Bottom Termination Components

Authors: Brook Sandy-Smith

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A Novel Epoxy Flux On Solder Paste for Assembling Thermally Warped PoP

Authors: Dr. Ning-Cheng Lee, Lee Kresge

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Low-Melting Metallic Sputtering Targets Bonded at Room Temperature

Authors: Jim Hisert

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Flux Challenges in Flip-Chip Die-Attach

Authors: Andy C. Mackie PhD, Jason Chou, Sze Pei Lim

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Choosing a Low-Cost Alternative to SAC Alloys for PCB Assembly

Authors: Brook Sandy-Smith, Dr. Ronald C. Lasky

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Challenges of Ball-Attach Process Using Flux for Fan-Out Wafer-Panel Level Packaging (FOWLP-PLP)

Authors: Dr. Yan Liu, Sze Pei Lim

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Challenges in Fine Feature Solder Paste Printing for SiP Applications

Authors: Andy C. Mackie PhD, Kenneth Thum, Sze Pei Lim

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The Perfect Preform—Designing In A Solution to Achieve Optimal Results

Authors: Carol Gowans

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Die-Attach Void Reduction by Using Gold Alloy Solder Preforms

Authors: Andy C. Mackie PhD, Bernard Leavitt

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Volumetric Characterization of Reservoir Printing in Deep Cavities

Authors: Brook Sandy-Smith, Mark Reese, Phani Vallabhajosyula, William Coleman

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Investigating Test Methods for Electrochemical Consistency in PCB Assembly Processes

Authors: Brook Sandy-Smith

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Novel Technique to Reduce Substrate Tilt and Improve Bondline Control Between AlN Substrate and AlSiC Baseplate in IGBT Module

Authors: Andy Dai, James Booth, Karthik Vijay, Kim Evans, Matthew Packwood, Paul Mumby-Croft

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High-Lead Solder Failure & Microstructure Analysis in Die-Attach Power Discrete Packages

Authors: HongWen Zhang, Sze Pei Lim

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Minimizing Voiding in BTCs by Optimizing Solder Paste Flux

Authors: Ed Briggs

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Meeting Solder Paste Printing Challenges for SiP in “Smart” IoT Devices

Authors: Andy C. Mackie PhD, Kenneth Thum, Sze Pei Lim

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Does Solder Particle Size Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue?

Authors: Eric Bastow

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Pressure-less Silver Sintering Paste for Low Porosity Joints and Large Area Die

Authors: Christine LaBarbera, Dr. Ning-Cheng Lee

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Wafer Bumping and Spin Coating Parameters for Enabling 2.5D and 3D Technology

Authors: Andy C. Mackie PhD

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System-in-Package (SiP) Assembly vs. Solder Paste Attributes

Authors: Andy C. Mackie PhD, Kenneth Thum, Sze Pei Lim

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Voiding Control at High-Power Die-Attach Preform Soldering

Authors: Dr. Ning-Cheng Lee, Elaina Zito

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Applications of Solder Preforms to Improve Reliability

Authors: Carol Gowans, Dr. Ronald C. Lasky

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Eliminate Lead-free Wave Soldering (English)

Authors: Rick Short

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Reservoir Printing in Deep Cavities

Authors: Brook Sandy-Smith

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A Unique Heating/Reflow Technique to Minimize Solder Paste-Induced Voiding Under LEDs

Authors: Derrick Herron

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Printing Capability Study of 008004 (0201 m) Components for SiP Applications - Part II

Authors: Jonas Sjoberg, Kenneth Thum

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A Comprehensive Guide to X-ray Inspection

Authors: Adam Murling, Brittany Vanderhoof

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Understanding the Effect of Different Heating Cycles on Post-soldering Flux Residues

Authors: Brook Sandy-Smith

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Does Thermal Cycling Impact the Electrical Reliability of a No-Clean Solder Paste Flux Residue

Authors: Eric Bastow

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Voiding Performance with Modified SAC Alloys for Automotive Applications in BTC Assemblies

Authors: Brook Sandy-Smith

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Process Optimization for Fine Feature Solder Paste Dispensing

Authors: Greg Wade, Brandon Judd

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Ultra-Low Voiding, Halogen-Free, No-Clean, Lead-Free Solder Paste for Large Pads

Authors: Dr. Ning-Cheng Lee, Li Ma

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The Versatile Preform

Authors: Ed Briggs

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Minimizing Voiding in SMT Assembly of BTCs

Authors: Christopher Nash, Dr. Ronald C. Lasky

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How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding

Authors: Brook Sandy-Smith

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Flux Challenges in Flip-Chip Die-Attach - Chinese

Authors: Andy C. Mackie PhD, Jason Chou, Sze Pei Lim

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Achieving Low-Porosity Sintering of Nano-Ag Paste via a Pressureless Process

Authors: Christine LaBarbera, Dr. Ning-Cheng Lee, Guangyu Fan, Lee Kresge

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Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework

Authors: Brook Sandy-Smith, Dr. Ronald C. Lasky, Ed Briggs

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Printing Capability Study of Components for SiP Applications

Authors: Jonas Sjoberg, Kenneth Thum, Sze Pei Lim

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High-Density Assembly and Root Cause Analyses

Authors: Christopher Nash, David Sbiroli, Jonas Sjoberg, Wisdom Qu

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BiAgX®: High-Temperature Lead-Free (Pb-free) Solder Paste

Authors: Andy C. Mackie PhD, HongWen Zhang

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Soldering Technology for Area Array Packages

Authors: Dr. Ning-Cheng Lee

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Porosity Evolution of Ag-Sintering at Die-Attach

Authors: Christine LaBarbera, Dr. Ning-Cheng Lee, Guangyu Fan, Lee Kresge

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Comparison of Test Methods for High Performance Thermal Interface Materials

Authors: Bob Jarrett, C.K. Merritt, Jim Hisert, Jordan Ross

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Determination of Total Halogen Content in Halogen-Free Fluxes by Inductively Coupled Plasma

Authors: Christopher J. Pontius, Dr. Ronald C. Lasky, George Kraeger

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Rosin vs. Non-Rosin Wave Flux: Which Creates More Reliable Electronic Assemblies?

Authors: Adam Murling, Dr. Ronald C. Lasky

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High-Reliability No-Clean Solder Paste for Designs Where Flux Cannot be Dried

Authors: Dr. Ning-Cheng Lee

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Optimal SMT Electronics Assembly Guidelines for Stencil Printing

Authors: Ed Briggs

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The Benefits of Flux-Coated Solder Preforms in a QFN Assembly Process

Authors: Brandon Judd

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Types of Solder Preforms and Difficult Geometries

Authors: Adam Murling

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The Graping Phenomenon: Improving Pb-Free Solder Coalescence Through Process and Material Optimization

Authors: Timothy Jensen

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A Novel Epoxy Flux on Solder Paste for Assembling Thermally Warped PoP

Authors: Dr. Ning-Cheng Lee, Lee Kresge

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Epoxy Flux: Exploring the Most Versatile, Low-Cost Approach for High Reliability in PoP Assembly

Authors: Dr. Ning-Cheng Lee

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Development with Metallic TIMs

Authors: Timothy Jensen

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Reliability of PCB Solder Joints Assembled with SACm® Solder Paste

Authors: Christine LaBarbera, Dr. Arnab Dasgupta, Dr. Ning-Cheng Lee, Fengying Zhou, Paul Bachorik

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Voiding Control Beneath Bottom Terminated Components Using Solder Fortification® Preforms

Authors: Andy Wei, Christopher Nash, Raymond Luo

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Sn+ Heat- Spring® Solder TIMs for Superior Thermal Management in IGBT Power Modules

Authors: Bob Jarrett, Graham Wilson

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Voiding Control Beneath BTCs Using Solder Fortification® Preforms SC

Authors: Andy Wei, Christopher Nash, Raymond Luo

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Epoxy Flux- A Low Cost High Reliability Approach for PoP Assembly

Authors: Dr. Ning-Cheng Lee

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How to Reduce Voiding in Components with Large Pads (Chinese)

Authors: Wisdom Qu

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Availability of Indium and Gallium (Chinese)

Authors: Bill Jackson, Claire Mikolajczak

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Fine Feature Stencil Printing 0.3MM Pitch Components (Chinese)

Authors: Dr. Ronald C. Lasky, Ed Briggs

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Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via MN or CE Doping (Chinese)

Authors: Dr. Ning-Cheng Lee

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Soldering Challenges in a Halogen-Free PCB Assembly Process (English)

Authors: Dr. Ronald C. Lasky, Timothy Jensen

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The Value of InPb Solders (Chinese)

Authors: Eric Bastow

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Dispelling 10 Myths of Nitrogen Reflow (Chinese Simplified)

Authors: Andy C. Mackie PhD

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Process and Solder Paste Considerations for BGA and QFN Voiding in a Tin-Lead Mixed System

Authors: Derrick Herron

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A Quick Guide to Solder Preforms

Authors: James Slattery

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ULR Semiconductor Grade Fluxes for Copper Pillar Flip-Chip

Authors: Sze Pei Lim

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SMQ®75 - A No-Clean Die-Attach Solder Paste for Clip-Bonding

Authors: Andy C. Mackie PhD, Sehar Samiappan

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Semiconductor Fluxes for Wafer Bumping in 3D Assembly

Authors: Andy C. Mackie PhD

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Risk and Mitigation for Tin Whiskers and Tin Pest

Authors: Dr. Ronald C. Lasky

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Reliability of PCB Solder Joints Assembled with SACm® Solder Paste

Authors: Dr. Arnab Dasgupta, Dr. Ning-Cheng Lee, Fengying Zhou, Paul Bachorik

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Low-Porosity Pressureless Sintering of Nano-Ag Paste for Die-Attach

Authors: Christine LaBarbera, Dr. Ning-Cheng Lee, Guangyu Fan, Lee Kresge

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Watch Video

Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes

Authors: Ed Briggs

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Understencil Wipe Cleaning Yields Improvements

Authors: Brook Sandy-Smith

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Alternative Pb-free Soldering Alloys (English)

Authors: Sehar Samiappan

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Alternative Pb-free Soldering Alloys (Spanish)

Authors: Sehar Samiappan

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Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues

Authors: Eric Bastow

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Voiding and Reliability of Assembly of BGA with SAC and 57Bi/42Sn/1Ag Alloys

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu

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C4 Interposer Requirements Driving High-Precision Flux Deposition

Authors: Andy C. Mackie PhD

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Measuring Tiny Deposits with Accuracy and Repeatability

Authors: Brook Sandy-Smith

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Probe Technologies to Improve First Pass Yields

Authors: Brook Sandy-Smith

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Optimizing Assembly of QFNs

Authors: Brook Sandy-Smith

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Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu

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The Second Generation Shock Resistant and Thermally-Reliable Low Ag SAC Solder with Mn

Authors: Dr. Ning-Cheng Lee

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Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing

Authors: Dr. Ronald C. Lasky

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Voiding Reduction in Bottom Terminated Components (BTC) with Improved Flux Coating

Authors: Dr. Ronald C. Lasky

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Spin-Coating Waferbumping Fluxes for Semiconductor Assembly: Ensuring Pristine Microbumps in Dimensional Devices

Authors: Andy C. Mackie PhD, Sze Pei Lim

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Watch Video

Reliability Challenges for Bottom Termination Components

Authors: Brook Sandy-Smith

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Watch Video

Update on Electrically Conductive Ink: Capabilities and Limitations

Authors: Dr. Ning-Cheng Lee

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Watch Video

Eliminating Bond Stress of Sputtering Targets at Operational Temperatures

Authors: Jim Hisert

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High Temperature, Pb-Free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil

Authors: Jim Hisert, Ronnie Spraker

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The Value of InPb Solders (English)

Authors: Eric Bastow

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Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping

Authors: Dr. Ning-Cheng Lee, Dr. Ronald C. Lasky, Timothy Jensen

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Indium-Lead (InPb) Solder Alloys for Reliable Gold Interconnects in Assembly Processes

Authors: Indium Corporation

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Material and Process Optimization for Head-in-Pillow Minimization

Authors: Dr. Ronald C. Lasky, Sehar Samiappan, Timothy Jensen

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Voiding Mechanism and Control in Mixed Solder Alloy Systems

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu

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Effects of Human-Induced Contamination on PCB Assembly Electrical Reliability

Authors: Eric Bastow

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QFN Voiding Control Via Solder Mask Patterning on Thermal Pads

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu

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High-Reliability, High-Melting, Mixed Lead-Free BiAgX® Solder Paste System

Authors: Dr. Ning-Cheng Lee, HongWen Zhang

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Reliability of BiAgX® Solder as a Drop-In Solution for High Temperature Lead-Free Die-Attach Applications

Authors: Dr. Ning-Cheng Lee, HongWen Zhang

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A Focus on Productivity and Profitability: Several Case Studies

Authors: Dr. Ronald C. Lasky

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Material and Process Optimization for HIP Defect Elimination

Authors: Dr. Ronald C. Lasky, Sehar Samiappan, Timothy Jensen

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The Effect of Thermal Pad Patterning on QFN Voiding

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu

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Voiding Behavior in Mixed Solder Alloy Systems

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu

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Watch Video

How to Reduce Voiding in Components with Large Pads

Authors: Wisdom Qu

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Watch Video

A Composite Solder Alloy Preform for High Temperature Pb-Free Soldering Applications

Authors: Dr. Ning-Cheng Lee, Paul Bachorik

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Process Guidelines to Ensure Optimal SMT Electronics Assembly

Authors: Dr. Ronald C. Lasky, Ed Briggs

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Solder Paste Dipping with 0.4mm Pitch PoP Packages

Authors: Christopher Nash

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Availability of Indium and Gallium (English)

Authors: Bill Jackson, Claire Mikolajczak

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High Melting Lead-Free Mixed BiAgX® Solder Paste System

Authors: Dr. Ning-Cheng Lee, HongWen Zhang

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No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability

Authors: Eric Bastow

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The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes

Authors: Brandon Judd

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RoHS: Five Years Later

Authors: Dr. Ronald C. Lasky

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NanoBond® Assembly - A Rapid, Room Temperature Soldering Process

Authors: Indium Corporation

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Novel Approaches to Benchmarking Solar Cell Tabbing Solderability

Authors: Indium Corporation

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High Temperature Lead-Free Solder Joints Via Mixed Powder System

Authors: Dr. Ning-Cheng Lee, HongWen Zhang

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Minimizing Voiding in QFN Packages Using Solder Preforms

Authors: Dr. Ronald C. Lasky

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Evaluation of Test Protocol for Eutectic Die-Attach Using High Power LEDs

Authors: Indium Corporation

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Epoxy Flux - A Low Cost High Reliability Approach for PoP Assembly

Authors: Dr. Ning-Cheng Lee

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Drop Test Performance of BGA Assembly Using SAC105Ti Solder Spheres

Authors: Dr. Ning-Cheng Lee

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Correlation of SIR, Halide/Halogen, and Copper Mirror Tests

Authors: Dr. Ronald C. Lasky

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Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume

Authors: Ed Briggs

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Understanding SIR

Authors: Christopher Nash, Eric Bastow

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Soldering Photovoltaic Cells

Authors: Indium Corporation

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Soldering Challenges in a Halogen-Free PCB Assembly Process (Chinese)

Authors: Dr. Ronald C. Lasky, Timothy Jensen

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Lead-Free Soldering of Chip-Scale Packages

Authors: Dr. Ning-Cheng Lee

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Watch Video

A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly

Authors: Ronnie Spraker

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Effect of Nano-Coated Stencil on 01005 Printing

Authors: Indium Corporation

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A Review of Test Methods and Classifications for Halogen-Free Soldering Materials

Authors: Timothy Jensen

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The Effects of Flux Residues on Electrical Reliability

Authors: Eric Bastow

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Thermal Pad Design and Process for Voiding Control at QFN Assembly

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu

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Voiding Control for QFN Assembly

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu

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The Question of Sample Size: Print Performance Trials for Solder Paste Evaluation

Authors: Indium Corporation

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Testing and Prevention of Head-In-Pillow

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu, Pamela Fiacco

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Specification Limits Review for Solder Paste Stencil Print Inspection (SPI)

Authors: David Sbiroli, Ed Briggs

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Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly

Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu, Pamela Fiacco

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Dispelling 10 Myths About Nitrogen Reflow

Authors: Andy C. Mackie PhD

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Process Optimization to Prevent the Graping Effect

Authors: Dr. Ronald C. Lasky, Ed Briggs

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Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)

Authors: Jim Hisert

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Influence of Reflow Profile and Pb-Free Solder Paste in Minimizing Voids for Quad Flat Pack No-Lead (QFN) Assembly

Authors: Ed Briggs, Timothy Jensen

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Area Ratio Sensitivity

Authors: Indium Corporation

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InTEGRATED® Preforms Streamline Soldering

Authors: Indium Corporation

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Electrically Conductive Ink: Capabilities and Limitations

Authors: Dr. Ning-Cheng Lee

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Die-Attach in Lead Frame Packages: A Tutorial

Authors: Dr. Ronald C. Lasky

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Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

Authors: Dr. Ronald C. Lasky

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An Effective Design of Experiment Strategy to Optimize SMT Processes

Authors: Dr. Ronald C. Lasky

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Implementing Pb-Free Assembly at Your Factory

Authors: Dr. Ronald C. Lasky, Timothy Jensen

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Best Practices Reflow Profiling for Lead-Free SMT Assembly (Chinese)

Authors: Dr. Ronald C. Lasky, Ed Briggs

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Challenges of Implementing a Halogen-Free PCB Assembly Process (Chinese)

Authors: Dr. Ronald C. Lasky, Timothy Jensen

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Head-in-Pillow: The Defect that Caught Us Napping (Chinese)

Authors: Timothy Jensen

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Solder Preform Basics (Chinese)

Authors: Indium Corporation

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Full Metal TIMs (Chinese)

Authors: Bob Jarrett, Jordan Ross, Ross B. Berntson

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Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly (Chinese)

Authors: Indium Corporation

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Voiding of Lead-Free Soldering at Microvia

Authors: Dr. Hyoryoon Jo, Dr. Ning-Cheng Lee

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The Basics of Soldering

Authors: Christopher Nash

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The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism

Authors: Dr. Ning-Cheng Lee, Paul Bachorik

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Stress-Free Bonding of Large Linear Sputtering Targets for LCD Displays

Authors:

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Soldering: Is the automotive assembler really different to anyone else?

Authors: Indium Corporation

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The Evolution Revolution in Flux

Authors: Andy C. Mackie PhD, Jim Hisert

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The Profit Sleuth

Authors: Dr. Ronald C. Lasky

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The Relationship of Components, Alloys and Fluxes

Authors: Dr. Ning-Cheng Lee

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The Road Ahead for Mobile Phone Manufacturing

Authors: Dr. Ronald C. Lasky

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Thermal Profiling: A Practical Approach to Reflow Profiling

Authors: Liyakathali Koorithodi

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Tin-Silver Bismuth: A Better Lead-Free Alternative?

Authors: Indium Corporation

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Wave and Rework in a Pb-Free Environment

Authors: Geoff Beckwith

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Virtues of Indium as a Thermal Interface Material

Authors: Dr. Ronald C. Lasky

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Solder Preform Basics (English)

Authors: Indium Corporation

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Solder Paste Technology

Authors: Liyakathali Koorithodi

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Six Sigma® Techniques for Solder Paste Selection

Authors: Dr. Ronald C. Lasky, Wang Ming

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Shock Reliability of BGAs Assembled With Capillary and No-Flow Underfill

Authors: Jim Hisert

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RoHS Recast

Authors: Dr. Ronald C. Lasky

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Prospects of Solder Paste in Ultra Fine Pitch Era

Authors: Dr. Ning-Cheng Lee

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Overview of Lead-Free Solders

Authors:

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Optimizing Your Stencil Printing Process

Authors: Brandon Judd

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Nothing Solders Like Solder...Or Does It?

Authors: Indium Corporation

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Next Level Requirements for Ultra Fine Pitch Printing

Authors: Indium Corporation

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New Developments in High Performance Solder Products for Power Die Assemblies

Authors: Andy C. Mackie PhD, Graham Wilson

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NC-SMQ®92J Case Study

Authors: Indium Corporation

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Metal Alloys for Thermal Interfacing

Authors: Jim Hisert

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InTEGRATED® preforms - Reflow Methods

Authors: Indium Corporation

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Choosing a Pb-Free Solder Paste

Authors: Christopher Nash

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Conquer Tombstoning in Lead-Free Soldering

Authors: Dr. Ning-Cheng Lee

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High Technology Challenge: Assembling Today's Miniaturized Electronics Products

Authors: Dr. Ronald C. Lasky

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Head-in-Pillow: The Defect that Caught Us Napping (English)

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