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Eliminating Bond Stress of Sputtering Targets at Operational Temperatures

Authors: Jim Hisert, Jon Major

Posted on 3 May 2013

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High Temperature, Pb-Free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil

Authors: Jacques Matteau, Jim Hisert, Jon Major, Ronnie Spraker

Posted on 25 Apr 2013

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Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping

Authors: Dr. Ning-Cheng Lee, Dr. Ronald C. Lasky, Dr. Weiping Liu, Timothy Jensen

Posted on 13 Mar 2013

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The Value of InPb Solders (English)

Authors: Eric Bastow

Posted on 13 Mar 2013

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Indium-Lead (InPb) Solder Alloys for Reliable Gold Interconnects in Assembly Processes

Authors: Maria Durham

Posted on 12 Mar 2013


Most Popular Whitepapers

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Process and Reliability Advantages of AuSn Eutectic Die-Attach

Authors: Amanda Hartnett, Steve Buerki

Posted on 5 Nov 2009

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Availability of Indium and Gallium (English)

Authors: Bill Jackson, Claire Mikolajczak

Posted on 23 Apr 2012

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Six Sigma® Techniques for Solder Paste Selection

Authors: Aniket A. Bhave, Dr. Daryl Santos, Dr. Ronald C. Lasky, Wang Ming

Posted on 9 Mar 2010

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Reflow Soldering: Meeting the SMT Challenge

Authors: Dr. Ning-Cheng Lee

Posted on 1 Jan 2009

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Leaded and Lead-Free Solder Paste Evaluation Screening Procedure

Authors: Aniket A. Bhave, Daryl Santos PhD, Dr. Ronald C. Lasky

Posted on 31 Mar 2010

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