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Flux Challenges in Flip-Chip Die-Attach
Authors: Andy C. Mackie PhD, Jason Chou, Maria Durham, Sze Pei Lim
Achieving Low-Porosity Sintering of Nano-Ag Paste via a Pressureless Process
Authors: Chris LaBarbera, Dr. Ning-Cheng Lee, Guangyu Fan, Indium Corporation, Lee Kresge, Sihai Chen, Xue Yan
Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework
Authors: Brook Sandy-Smith, Dr. Ronald C. Lasky, Ed Briggs
Printing Capability Study of Components for SiP Applications
Authors: Jonas Sjoberg, Kenneth Thum, Sze Pei Lim
High-Density Assembly and Root Cause Analyses
Authors: Christopher Nash, David Sbiroli, Jonas Sjoberg, Wisdom Qu
Flux Challenges in Flip-Chip Die-Attach
Authors: Andy C. Mackie PhD, Jason Chou, Maria Durham, Sze Pei Lim
Porosity Evolution of Ag-Sintering at Die-Attach
Authors: Chris LaBarbera, Dr. Ning-Cheng Lee, Guangyu Fan, Lee Kresge, Sihai Chen
Comparison of Test Methods for High Performance Thermal Interface Materials
Authors: Bob Jarrett, C.K. Merritt, Jim Hisert, Jordan Ross
Determination of Total Halogen Content in Halogen-Free Fluxes by Inductively Coupled Plasma
Authors: Christopher J. Pontius, Dr. Ronald C. Lasky, George Kraeger
Rosin vs. Non-Rosin Wave Flux: Which Creates More Reliable Electronic Assemblies?
Authors: Adam Murling, Dr. Ronald C. Lasky
The Benefits of Flux-Coated Solder Preforms in a QFN Assembly Process
Authors: Brandon Judd, Maria Durham
High-Reliability No-Clean Solder Paste for Designs Where Flux Cannot be Dried
Authors: Dr. Ning-Cheng Lee
The Graping Phenomenon: Improving Pb-Free Solder Coalescence Through Process and Material Optimization
Authors: Timothy Jensen
A Novel Epoxy Flux on Solder Paste for Assembling Thermally Warped PoP
Authors: Dr. Ning-Cheng Lee, Lee Kresge, Ming Hu
Epoxy Flux: Exploring the Most Versatile, Low-Cost Approach for High Reliability in PoP Assembly
Authors: Dr. Ning-Cheng Lee
Voiding Control Beneath Bottom Terminated Components Using Solder Fortification® Preforms
Authors: Andy Wei, Christopher Nash, Derrick Herron, Raymond Luo
Sn+ Heat- Spring® Solder TIMs for Superior Thermal Management in IGBT Power Modules
Authors: Bob Jarrett, Graham Wilson
Voiding Control Beneath BTCs Using Solder Fortification® Preforms SC
Authors: Andy Wei, Christopher Nash, Derrick Herron, Raymond Luo
Fine Feature Stencil Printing 0.3MM Pitch Components (Chinese)
Authors: Dr. Ronald C. Lasky, Ed Briggs
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via MN or CE Doping (Chinese)
Authors: Dr. Ning-Cheng Lee
Soldering Challenges in a Halogen-Free PCB Assembly Process (English)
Authors: Dr. Ronald C. Lasky, Timothy Jensen
Can Age and Storage Conditions Affect the SIR Performance of a No-Clean Solder Paste Flux Residue
Authors: Eric Bastow
Process and Solder Paste Considerations for BGA and QFN Voiding in a Tin-Lead Mixed System
Authors: Derrick Herron
SMQ®75 - A No-Clean Die-Attach Solder Paste for Clip-Bonding
Authors: Andy C. Mackie PhD, Sehar Samiappan
Reliability of PCB Solder Joints Assembled with SACm® Solder Paste
Authors: Christine LaBarbara, Dr. Arnab Dasgupta, Dr. Ning-Cheng Lee, Fengying Zhou, Paul Bachorik
Low-Porosity Pressureless Sintering of Nano-Ag Paste for Die-Attach
Authors: Chris LaBarbera, Dr. Ning-Cheng Lee, Guangyu Fan, Lee Kresge, Sihai Chen
Epoxy Flux - A Low Cost High Reliability Approach for PoP Assembly (Chinese)
Authors: Dr. Ning-Cheng Lee
Effect of Reflow Profiling on the Electrical Reliability of No-Clean Solder Paste Flux Residues
Authors: Eric Bastow
Voiding and Reliability of Assembly of BGA with SAC and 57Bi/42Sn/1Ag Alloys
Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu, Erin Page, Joanna Keck
Voiding and Reliability of BGA Assemblies with SAC and BiSnAg Alloys
Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu, Erin Page, Joanna Keck
The Second Generation Shock Resistant and Thermally-Reliable Low Ag SAC Solder with Mn
Authors: Dr. Ning-Cheng Lee
Using Weibull Analysis to Interpret Failure Data in Electronics Assembly Stress Testing
Authors: Dr. Ronald C. Lasky
Voiding Reduction in Bottom Terminated Components (BTC) with Improved Flux Coating
Authors: Dr. Ronald C. Lasky
Spin-Coating Waferbumping Fluxes for Semiconductor Assembly: Ensuring Pristine Microbumps in Dimensional Devices
Authors: Andy C. Mackie PhD, Maria Durham, Sze Pei Lim
High Temperature, Pb-Free, Metallic Sputtering Target Bonding Using Reactive Multilayer Foil
Authors: Jim Hisert, Ronnie Spraker
Achieving High Reliability Low-Cost Lead-Free SAC Solder Joints via Mn Doping
Authors: Dr. Ning-Cheng Lee, Dr. Ronald C. Lasky, Timothy Jensen
Indium-Lead (InPb) Solder Alloys for Reliable Gold Interconnects in Assembly Processes
Authors: Maria Durham
Material and Process Optimization for Head-in-Pillow Minimization
Authors: Dr. Ronald C. Lasky, Sehar Samiappan, Timothy Jensen
Voiding Mechanism and Control in Mixed Solder Alloy Systems
Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu, Joanna Keck
QFN Voiding Control Via Solder Mask Patterning on Thermal Pads
Authors: Derrick Herron, Dr. Ning-Cheng Lee, Dr. Yan Liu
High-Reliability, High-Melting, Mixed Lead-Free BiAgX® Solder Paste System
Authors: Dr. Ning-Cheng Lee, HongWen Zhang
Reliability of BiAgX® Solder as a Drop-In Solution for High Temperature Lead-Free Die-Attach Applications
Authors: Dr. Ning-Cheng Lee, HongWen Zhang
Material and Process Optimization for HIP Defect Elimination
Authors: Dr. Ronald C. Lasky, Sehar Samiappan, Timothy Jensen
The Effect of Thermal Pad Patterning on QFN Voiding
Authors: Derrick Herron, Dr. Ning-Cheng Lee, Dr. Yan Liu
Voiding Behavior in Mixed Solder Alloy Systems
Authors: Derrick Herron, Dr. Ning-Cheng Lee, Dr. Yan Liu, Joanna Keck
A Composite Solder Alloy Preform for High Temperature Pb-Free Soldering Applications
Authors: Dr. Ning-Cheng Lee, Paul Bachorik
Process Guidelines to Ensure Optimal SMT Electronics Assembly
Authors: Dr. Ronald C. Lasky, Ed Briggs
No-Clean Flux Residue and Underfill Compatibility Effects on Electrical Reliability
Authors: Eric Bastow
The Effect of Powder Surface Area and Oxidation on the Voiding Performance of PoP Solder Pastes
Authors: Brandon Judd
High Temperature Lead-Free Solder Joints Via Mixed Powder System
Authors: Dr. Ning-Cheng Lee, HongWen Zhang
Evaluation of Test Protocol for Eutectic Die-Attach Using High Power LEDs
Authors: Indium Corporation
Choosing a Low-Cost Alternative to SAC Alloys for PCB Assembly
Authors: Brook Sandy-Smith, Dr. Ronald C. Lasky
Stencil Printing Transfer Efficiency of Circular vs. Square Apertures with the Same Solder Paste Volume
Authors: Ed Briggs
Soldering Challenges in a Halogen-Free PCB Assembly Process (Chinese)
Authors: Dr. Ronald C. Lasky, Timothy Jensen
A Room Temperature, Low-Stress Bonding Process to Reduce the Impact of Use Stress on a Sputtering Target Assembly
Authors: Ronnie Spraker
A Review of Test Methods and Classifications for Halogen-Free Soldering Materials
Authors: Timothy Jensen
Thermal Pad Design and Process for Voiding Control at QFN Assembly
Authors: Derrick Herron, Dr. Ning-Cheng Lee, Dr. Yan Liu
Room Temperature LED and D-Pak Type Component-Attach and Reliability Testing
Authors: Mario Scalzo, Thomas Acchione
Voiding Control for QFN Assembly
Authors: Derrick Herron, Dr. Ning-Cheng Lee, Dr. Yan Liu
The Question of Sample Size: Print Performance Trials for Solder Paste Evaluation
Authors: Indium Corporation
Testing and Prevention of Head-In-Pillow
Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu, Pamela Fiacco
Specification Limits Review for Solder Paste Stencil Print Inspection (SPI)
Authors: David Sbiroli, Ed Briggs
Selection of Dip Transfer Fluxes and Solder Pastes for PoP Assembly
Authors: Derrick Herron, Dr. Ning-Cheng Lee, Dr. Yan Liu, Pamela Fiacco
Low-Melting Metallic Sputtering Targets Bonded At Room Temperature (Ambient)
Authors: Jim Hisert, Thomas Acchione
Influence of Reflow Profile and Pb-Free Solder Paste in Minimizing Voids for Quad Flat Pack No-Lead (QFN) Assembly
Authors: Ed Briggs, Timothy Jensen
Best Practices Reflow Profiling for Lead-Free SMT Assembly (Chinese)
Authors: Dr. Ronald C. Lasky, Ed Briggs
Challenges of Implementing a Halogen-Free PCB Assembly Process (Chinese)
Authors: Dr. Ronald C. Lasky, Timothy Jensen
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly (Chinese)
Authors: Mario Scalzo
Voiding of Lead-Free Soldering at Microvia
Authors: Dr. Hyoryoon Jo, Dr. Ning-Cheng Lee
The Superior Drop Test Performance of SAC-Ti Solders and Its Mechanism
Authors: Dr. Ning-Cheng Lee, Paul Bachorik
Stress-Free Bonding of Large Linear Sputtering Targets for LCD Displays
Authors: A. Zunger
Six Sigma® Techniques for Solder Paste Selection
Authors: Dr. Ronald C. Lasky, Wang Ming
New Developments in High Performance Solder Products for Power Die Assemblies
Authors: Andy C. Mackie PhD, Graham Wilson
High Technology Challenge: Assembling Today's Miniaturized Electronics Products
Authors: Dr. Ronald C. Lasky
Future Lead-Free Solder Alloys and Fluxes-Meeting Challenges of Miniaturization
Authors: Dr. Ning-Cheng Lee
Fine Powder Solder Pastes: Stencil Printing and Reflow in Lead-Free Assembly
Authors: Dr. Ronald C. Lasky, Ed Briggs, Timothy Jensen
Fine Feature Stencil Printing 0.3MM Pitch Components (English)
Authors: Dr. Ronald C. Lasky, Ed Briggs
Effect of Lead-Free Alloys on Voiding at Microvia
Authors: Dr. Arnab Dasgupta, Dr. Ning-Cheng Lee
Compatibility of Polymers and Fluxes: Getting to the Heart of the Matter
Authors: Andy C. Mackie PhD, Chris Nash
Challenges of Implementing a Halogen-Free PCB Assembly Process (English)
Authors: Dr. Ronald C. Lasky, Timothy Jensen
Achieving High Reliability Low Cost Lead-Free SAC Solder Joints Via MN or CE Doping (English)
Authors: Dr. Ning-Cheng Lee
A Novel Flexible Silver Paste Enables Thin Film Photovoltaic Flex Solar Cells
Authors: Dr. Ning-Cheng Lee, James Slattery, Lee Kresge
A Model Study of Profiling for Voiding Control at Lead-free Reflow Soldering
Authors: Dr. Ning-Cheng Lee, Dr. Yan Liu
Thermal Management Materials Choices
Authors: Andy C. Mackie PhD, Bob Jarrett, Dave Saums, Jordan Ross
Best Practices Reflow Profiling for Lead-Free SMT Assembly (English)
Authors: Dr. Ronald C. Lasky, Ed Briggs
Establishing a Precision Stencil Printing Process for Miniaturized Electronics Assembly
Authors: Indium Corporation
Addressing the Challenge of Head-in-Pillow Defects in Electronics Assembly (English)
Authors: Mario Scalzo
Solder Paste: Meeting The SMT Challenge
Authors: Dr. Ning-Cheng Lee, Gregory Evans
Sealing the Gap of Solder Paste Technology in Lead-Free Halogen-Free Era
Authors: Dr. Arnab Dasgupta, Dr. Ning-Cheng Lee, Dr. Yan Liu
Ionic Cleanliness Testing Research of Printed Wiring Boards for Purposes of Process Control
Authors: Dr. Ning-Cheng Lee
Engineering Solder Paste Performance Via Controlled Stress Rheology Analysis
Authors: Dr. Ning-Cheng Lee
A Drop-In Lead-Free Solder Replacement
Authors: Dr. Ning-Cheng Lee, James Slattery, John R. Sovinsky
Through-Hole Assembly Options for Mixed Technology Boards
Authors: Dr. Ronald C. Lasky, Ross B. Berntson
Most Popular Whitepapers
Advantages of Bismuth-based Alloys for Low Temperature Pb-free Soldering and Rework
Authors: Brook Sandy-Smith, Dr. Ronald C. Lasky, Ed Briggs
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