Application Notes

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Engineered Solder Materials

AuSn - The Unique Eutectic Solder Alloy (Letter)
Eliminating Flux Residue in OPTO-Electronic Packages (Letter)
Flux and Solder Compatibility (Letter)
Flux-Coated Solder Preforms: Potential Process Issues, Causes, and Solutions (Letter)
Fluxless Soldering (Letter)
How to use Fusible Alloys (Letter) (A4)
Indium Thermal Interface Materials (Letter)
Information That Should Appear on a Print/Drawing/Specification (Letter) (A4)
Pb-Free Solder Frequently Asked Questions (Letter) (A4)
Practical Suggestions for Solder Preform Design (Letter)
Preform Packaging Guide (Letter)
Procedures for Handling Indalloys (Liquid at Room Temperature) (Letter)
Soldering 101 - A Basic Overview (Letter) (A4)
Storage and Handling of Flux-Coated Preforms (Letter)
Storage and Handling of Solder Preforms, Wire and Ribbon (Letter) (A4)
Substrate Metallization Considerations For Soldering (Letter)
Use of INDALLOY® low temperature alloys for lens blocking (Letter)
Using Flux-Coated Preforms in Soldering (Letter)

Indium Alloy and its uses

Bonding Non-Metallic Materials using Indium and High Indium Alloys (Letter)
Common Elements (Letter)
Determination of Solidus and Liquidus Temperatures of Alloys using a Differential Scanning Calorimeter (Letter)
Etching Indium to Remove Oxides (Letter)
Indium Cold Welding (Letter)
Indium for Sealing (Letter)
Indium/Copper Intermetallics (Letter)
Indium/Lead Soldering to Gold (Letter)
Physical Constants of Pure Indium (Letter)
The Use of Indium Chemicals in Alkaline Battery Manufacturing (Letter)

Indium Compounds

Indium Oxide & Indium-Tin Oxide (ITO) Coatings (Letter) (A4)
The Use of Indium Chemicals in Alkaline Battery Manufacturing (Letter)

Indium Plating

Achieving a Finer Grain Structure Using the Indium Sulfamate Plating Bath (Letter) (A4)
Indium Bump Electroplating of Wafers Using Pulse Plating (Letter) (A4)
Plating, an Alternative Method of Applying Indium (Letter) (A4)
Proper Surface Preparation For Indium Plating (Letter)
Prototype Plating Using Indium Sulfamate Plating Bath (Letter)
Reclamation & Disposal of In Sulfamate Plating Bath Solution (Letter)

NanoFoil

Bonding Sputtering Targets with NanoFoil® (Letter)
Component Mounting with NanoBond® and NanoFoil® (Letter)
High Brightness LED Thermal Attach with NanoBond® (Letter)
Large Area Bonding Using NanoFoil® (Letter)
NanoBond® of Ceramic and Metal Sputtering Targets (Letter) (A4)
NanoBond® Thermal Interface (Letter)
NanoBond®: The Process for Using NanoFoil (Letter)
NanoFoil® User Guide (Letter) (A4)
Power Amplifier Module and PCB Attach with NanoFoil® (Letter)

Semiconductor Materials

Setting Up a Package-On-Package Assembly Process (Letter)
Soft Solder Die-Attach (Letter)
Storage and Handling of Specialty Fluxes (Letter)
Variables of Pin Transfer (Letter)

Solar Materials

Achieving A Finer Grain Structure Using The Indium Sulfamate Plating Bath A4 (A4)
CVD vs. PVD Advantages and Disadvantages (Letter) (A4)
Maximizing the Shelf Life of LT-918 Low Temperature Metallization Paste (Letter)
Test Methods for Measuring the Volume Resistivity and Contact Resistance of LTTF-7888 Solar Metallization Paste A4 (A4)
Test Methods for Metallization Paste (Letter)

Solder Paste

Calculating Solder Paste Usage (Letter) (A4)
Cleaning Processes with Kyzen Cleaning Materials (Letter)
Cleaning Processes with Zestron Cleaning Materials (Letter)
Component Adhesions (Letter)
Converting a SAC387 Solder Pot to SAC305 (Letter) (A4)
Eliminating Solder Paste Hang-Up on Squeegee Blades (Letter)
Guidelines for Diagnosing Contamination of SAC305 Solder Pots/Baths (Letter)
Indium WS-554-89-4 (Letter)
Indium8.9 Pb-Free Solder Paste (Letter)
Indium8.9ATG Pb-Free Solder Paste (Letter)
Intro to Aqueous Cleaning Equipment (Letter)
Issues Causing Head-in-Pillow Defects (Letter)
Optimizing Reflow (Letter)
Optimizing Solder Paste Parameters for Syringe Dispensing (Letter)
Pb-Free Solder Frequently Asked Questions (Letter) (A4)
Powder Choice Stencil Design Guidelines (Letter) (A4)
Reducing Solder Beads and Solder Balls (Letter) (A4)
Solder Paste & Printer Recommendations for Printers (Letter)
Soldering 101 - A Basic Overview (Letter) (A4)
Substrate Metallization Considerations For Soldering (Letter)
Suggestions For Monitoring A Flux Cleaning Line (Letter)
Suggestions to Minimize Tombstoning (Letter)
Understanding Flux Vehicle Chemistry (Letter) (A4)
Vapor-Phase Soldering Process (Letter)
Verification of In-House Pb Testing Methods (Letter)

Soldering to Aluminum

Soldering to Aluminum (Letter)

Soldering to Gold and Gold Alloys

Indium/Lead Soldering to Gold (Letter)
Soldering to Gold - Alloy Choice and Limitations (Letter)

Soldering to Nitinol

Soldering to Nitinol (Letter)
Soldering to Nitinol, by Fort Wayne Metals (Letter)

Thermal Interface Materials

Designing a STIM for Worst Case Bondline Thickness (Letter)
Heat-Spring® Metallic TIMs for Infineon IGBT Modules (Letter)
Heat-Spring® Packaging Guide (Letter)
Thermal Interface Materials (Letter) (A4)
Use of Heat-Spring® Material (Letter)
What is a Thermal Interface? (Letter) (A4)

Underfills

Advantages of the No-Flow Underfill Process (Letter) (A4)
Dispensing NF-260 Using Speedline XyflexPro (Letter)
No-Flow Underfill Handling Guidelines (Letter)
No-Flow Underfill Process Guidelines (Letter)
Sample Dispense Parameters for NF260 (Letter)
Selecting the appropriate Tg for Underfill (Letter)

From One Engineer to Another®

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