Solder Paste and Powders
Indium Corporation’s high quality solder powders and pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements. Powders are available in hundreds of alloys and sizes from Type 3 to Type 7-SG. Solder pastes can be made from these powders using a wide variety of flux vehicles to achieve the best results for your application. Specialized pastes are available for printing, dipping, dispensing, and pin transfer assembly.Questions about the best type of solder powder or solder paste for your application?
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If you think about it, to evaluate any process you typically want to know its precision and accuracy. Look at the dart players in the Figure 1 below. The yellow player has good precision, but his accuracy is off.
The area ratio of a stencil aperture is the area of the aperture opening divided by the area of the side walls. It is interesting, as Ismail points out, that the area ratio of a circular aperture is the same as that of a square aperture.
Solder paste is likely the most complex material used in any manufacturing process. I think most people know that solder paste is a combination of solder powder and flux; at first blush it seems quite simple.
Let's explore the SiP process, especially the solder paste printing process.
Let's explore the printing differences between no-clean and water-soluble solder paste.
This video is for anyone interested in the role of solder paste particle size with regard to reflow and printing.
So many exciting things were going on that Patty’s head was spinning. A deer had just given birth to a fawn in her back yard. What an event for her twin sons to witness.
Voiding is a complex problem with complex solutions. It isn't always just a matter of switching out the solder paste and finding the solution. If you're being challenged to voiding issues, contact Indium Corporation.
Indium Corporation's Product Manager of PCB Solder Paste Glen Thomas discusses the reliability of Indium10.1 and Indium8.9HF and how they are made to help you Avoid the Void™.
In a previous post I spoke about Large Ground Plane Voiding in Electronics Assembly and referred to a statistical tool called an Ishikawa diagram. This tool helps map out a process and provide an excellent visual aid that helps show the potential defect causes and the effects the process variables can have.
The combination of the reflow profile and flux characteristics that produces outgassing before the solder becomes liquid (the red curve) will minimize voiding.
From One Engineer to Another®
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