Solder Paste and Powders
Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for your application. Specialized pastes are available for printing, dipping, dispensing, and package-on-package (PoP) assembly.
If you have any question about the best type of solder powder or solder paste for your application, please feel free to contact us. Our technical support engineers are ready to help you in any way they can.
Solder Paste and Powders Technical Documents
Product Data Sheets
Material Safety Data Sheets
Solder Paste Blog Posts
Waferbumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste printing (with all its concerns of voiding, coplanarity, stencil-life, and spatter) to plated solderbumps, and now to plated copper pillars with microbumps…
Folks, We tend to think of mixing as something that can completely even out those things being mixed. As an example, let’s assume you are making chocolate chip cookies and would like to have 10 chocolate chips in each large cookie. You make enough batter for 100 cookies and then…
The attachment of concentrated photovoltaic (CPV) cells is the perfect application for NanoFoil®. Due to the isolated heating during bonding, less stresses are imparted due to coefficient of thermal expansion. Unlike conductive adhesives or epoxies, NanoBonds® are full metal interfaces which…
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