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Solder Paste and Powders

Home » Products » Solder Paste and Powders

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Solder Paste and Powders

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for your application. Specialized pastes are available for printing, dipping, dispensing, and package-on-package (PoP) assembly.

If you have any question about the best type of solder powder or solder paste for your application, please feel free to contact us. Our technical support engineers are ready to help you in any way they can.

  • SACM
  • Indium8.9 Series
  • Lead Free
  • Tin Lead
  • Package-on-Package Paste
  • Low Temperature/High Temperature
  • Die-Attach
  • Wafer Bumping Paste
  • Solder Fortification®
  • Paste
  • Solder Alloy Chart

Solder Paste and Powders Technical Documents

Whitepapers

Request This Document

Fine Powder Solder Pastes: Stencil Printing and Reflow in Lead-Free Assembly

Authors: Chris Anglin, Dr. Ronald C. Lasky, Ed Briggs, Timothy Jensen

Posted on 4 Mar 2010

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No-Clean Soldering Process

Authors: Dr. Ning-Cheng Lee

Posted on 1 Jan 2009

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Prospect of Lead Free Alternatives for Reflow Soldering

Authors: Dr. Benlih Huang, Dr. Ning-Cheng Lee

Posted on 1 Jan 2009

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Reliability of BiAgX Solder as a Drop-In Solution for High Temperature Lead-Free Die-Attach Applications

Authors: Dr. Ning-Cheng Lee, HongWen Zhang

Posted on 18 Oct 2012

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Solder Bumping Via Paste Reflow For Area Array Packages

Authors: Dr. Benlih Huang, Dr. Ning-Cheng Lee

Posted on 1 Jan 2009

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Soldering Technology for Area Array Packages

Authors: Dr. Ning-Cheng Lee, William Casey

Posted on 10 Mar 2010

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The Effect of Thermal Pad Patterning on QFN Voiding

Authors: Derrick Herron, Dr. Ning-Cheng Lee, Dr. Yan Liu

Posted on 18 Oct 2012

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Voiding Behavior in Mixed Solder Alloy Systems

Authors: Derrick Herron, Dr. Ning-Cheng Lee, Dr. Yan Liu, Joanna Keck

Posted on 18 Oct 2012

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Application Notes

Calculating Solder Paste Usage (Letter) (A4)
Eliminating Solder Paste Hang-Up on Squeegee Blades (Letter)
Optimizing Solder Paste Parameters for Syringe Dispensing (Letter)
Powder Choice Stencil Design Guidelines (Letter) (A4)
Solder Paste & Printer Recommendations for Printers (Letter)

Product Data Sheets

BP-3106 BGA Bumping Solder Paste (Letter) (A4)
Indalloy 182 Gold-Tin Solder Paste (Letter) (A4)
Indium3.1 Pb-Free Water-Soluble Solder Paste (Letter) (A4)
Indium3.1AF Pb-Free Water-Soluble Solder Paste (Letter) (A4)
Indium3.2 Pb-Free Water-Soluble Solder Paste (Letter) (A4)
Indium3.2HF Water-Soluble Solder Paste (Letter) (A4)
Indium5.1 Pb-Free Solder Paste (Letter) (A4)
Indium5.1AT Pb-Free Solder Paste (Letter) (A4)
Indium5.5LT Solder Paste (Letter)
Indium5.7LT Solder Paste (Letter)
Indium5.8LS Pb-Free Solder Paste (Letter) (A4)
Indium6.2 Water-Soluble Solder Paste (Letter) (A4)
Indium6.3 Water-Soluble Solder Paste (Letter) (A4)
Indium6.4 Water-Soluble SnPb Solder Paste (Letter)
Indium6.8 Solder Paste (Letter)
Indium8.9 Pb-Free Solder Paste (Letter) (A4)
Indium8.9E Pb-Free Solder Paste (Letter) (A4)
Indium8.9HF Pb-Free Solder Paste (Letter) (A4)
Indium8.9HF SnPb Solder Paste (Letter) (A4)
Indium8.9HF-1 Pb-Free Solder Paste (Letter) (A4)
Indium8.9HF1-S3 Solder Paste (Letter) (A4)
Indium8.9HFA Pb-Free Solder Paste (Letter) (A4)
Indium9.0A Pb-Free Solder Paste (Letter) (A4)
Indium9.52 Die Attach Solder Paste A4 (A4)
Indium9.72 Die Attach Solder Paste (Letter) (A4)
NC-SMQ230 Pb-Free Solder Paste (Letter) (A4)
NC-SMQ51SC Solder Paste (Letter) (A4)
NC-SMQ57 No-Clean Solder Paste (Letter) (A4)
NC-SMQ80 Solder Paste (Letter)
NC-SMQ81 Solder Paste (Letter)
NC-SMQ90 Solder Paste (Letter) (A4)
NC-SMQ92 Solder Paste (Letter)
NC-SMQ92H Solder Paste (Letter) (A4)
NC-SMQ92J Solder Paste (Letter) (A4)
NC-SMQ92J-UV Solder Paste (Letter)
NC-SMQ®75 Solder Paste (Letter) (A4)
RMA-F Solder Paste (Letter)
RMA-SMQ51A Solder Paste (Letter) (A4)
RMA-SMQ51AC Solder Paste (Letter) (A4)
Solder Alloy Chart (Letter)
WMA-SMQ69HT High Temperature Water Soluble Solder Paste (Letter) (A4)

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Material Safety Data Sheets

Indalloy® 104 with Indium 6.1
Indalloy® 106 with Superflex 12-4
Indalloy® with BP-3106
Indalloy® with Indium1.38-HF
Indalloy® with Indium3.1AF
Indalloy® with Indium3.2HF
Indalloy® with Indium5.1
Indalloy® with Indium5.1ATR
Indalloy® with Indium5.79
Indalloy® with Indium5.81
Indalloy® with Indium5.9CD
Indalloy® with Indium6.3
Indalloy® with Indium6.8
Indalloy® with Indium8.9
Indalloy® with Indium8.9E (ULA)
Indalloy® with Indium8.9HF1
Indalloy® with Indium8.9HFA
Indalloy® with indium9.0A
Indalloy® with Indium9.32
Indalloy® with Indium9.72 and 9.72-MD
Indalloy® with Indium9.88
Indalloy® with NC-SMQ230
Indalloy® with NC-SMQ58
Indalloy® with NC-SMQ75A
Indalloy® with NC-SMQ80
Indalloy® 106 with Indium 6.1
Indalloy® 151 with Indium9.12
Indalloy® with GS1919
Indalloy® with Indium3.1
Indalloy® with Indium3.2
Indalloy® with Indium3.3
Indalloy® with Indium5.1AT
Indalloy® with Indium5.5LT
Indalloy® with Indium5.7LT
Indalloy® with Indium5.8LS
Indalloy® with Indium6.2
Indalloy® with Indium6.4
Indalloy® with Indium8.8
Indalloy® with Indium8.9E
Indalloy® with Indium8.9HF
Indalloy® with Indium8.9HF1-M2
Indalloy® with Indium8.9LDA
Indalloy® with Indium9.0E
Indalloy® with Indium9.52
Indalloy® with Indium9.72HF
Indalloy® with Indium9.88HF
Indalloy® with NC-SMQ57
Indalloy® with NC-SMQ71
Indalloy® with NC-SMQ75M
Indalloy® with NC-SMQ81

View All

Solder Paste Blog Posts

Reflow of Copper Pillar Microbumps

Monday, June 10, 2013 by Dr. Andy Mackie [view bio]

Waferbumping processes have evolved in the last 10 years. The semiconductor assembly industry has gone from bumping processes using solder paste printing (with all its concerns of voiding, coplanarity, stencil-life, and spatter) to plated solderbumps, and now to plated copper pillars with microbumps…

The Limits of Mixing: A Chocolate Chip Example

Thursday, May 30, 2013 by Dr. Ron Lasky [view bio]

Folks, We tend to think of mixing as something that can completely even out those things being mixed.  As an example, let’s assume you are making chocolate chip cookies and would like to have 10 chocolate chips in each large cookie.  You make enough batter for 100 cookies and then…

NanoFoil® for CPV Attachment

Thursday, April 18, 2013 by Jim Hisert [view bio]

The attachment of concentrated photovoltaic (CPV) cells is the perfect application for NanoFoil®. Due to the isolated heating during bonding, less stresses are imparted due to coefficient of thermal expansion. Unlike conductive adhesives or epoxies, NanoBonds® are full metal interfaces which…

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Tim Jensen

This page is owned by:

Tim Jensen
Product Manager, PCB Assembly Materials
tjensen@indium.com

INDIUM CORPORATIONwww.indium.comaskus@indium.comPRC +86 (0)512 628 34900SINGAPORE +65 6 268 8678UK +44 (0) 1908 580400USA +1 315 853 4900

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