BiAgX®: A Drop-In Replacement for High-Pb Solders
Environmental and legislative concerns are driving consumers away from products that contain lead, including solders used in die-attach applications for analog semiconductor assembly.
BiAgX® is a high-melting, lead-free (Pb-free) solder paste technology that serves as a DROP-IN replacement for the high-Pb solder pastes used in many high-reliability die-attach and electronics assembly applications.
BiAgX® is the ONLY low-cost, lead-free replacement solder paste that is customer-proven to survive JEDEC/IPC J-STD-020 MSL1 preconditioning in specific devices without delamination.
Options for Metallic Die-Attach Materials
- Drop-in replacement for high Pb-containing solder pastes, requiring minimal process optimization and no new capital expenditure
- Both Pb-free and Sb-free, conforming to applicable standards
- Available in both dispense and printing forms, like standard die-attach solder paste
- Reflows, solders, and solidifies like other solder paste
- Fluxes are cleanable with standard cleaning chemistry and processes
- Requires minimal adjustments when converting from a standard high-Pb solder paste-based process
- Suited to smaller die and lower voltage applications, such as those used in QFN packages for portable electronics, automotive, and industrial applications
- Contains no costly specialty materials, such as nanoparticles or gold
- Requires no pressure on the die during the reflow process
- Designed to work in high-temperature environments at temperatures in excess of 150°C with no degradation of the mechanical structure or other properties
This patent-pending technology is evolving into a family of products, all based around a platform technology.
Indium Corporation also offers other die-attach solder materials, and is currently the only materials supplier in the Automotive Electronics Council (AEC).
- Solder Pastes - dispense and print
- Solder Preforms
- Solder Ribbon and Foil
- Die-Attach Wire
- Indium-based solders
- Gold-tin solders
Related Markets and Applications
Top BiAgX® Technical Documents
High Melting Lead-Free Mixed BiAgX® Solder Paste System (Paper)
Reliability of BiAgX® Solder as a Drop-In Solution for High Temperature Lead-Free Die-Attach Applications (Paper)
High-Reliability, High-Melting, Mixed Lead-Free BiAgX® Solder Paste System (Paper)
SMTAnews Journal April-June 2013 (Other)
BiAgX® Presentation, 2015 (Presentation)
BiAgX® Technical Documents
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Product Data Sheets
Safety Data Sheets
BiAgX® Blog Posts
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From One Engineer to Another®
All of Indium Corporation’s products and solutions are designed to be commercially available
unless specifically stated otherwise.